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參數資料
| 型號： | UBA2070 |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit MCU for automotive with 16 to 60 Kbyte Flash, ADC, CSS, 5 timers, SPI, SCI, I2C interface |
| 中文描述： | 600伏冷陰極鎮流器驅動IC |
| 文件頁數： | 16/20頁 |
| 文件大小： | 109K |
| 代理商： | UBA2070 |
2002 Oct 24
16
Philips Semiconductors
Product specification
600 V CCFL ballast driver IC
UBA2070
SOLDERING
Introduction
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Surface mount packages
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 220
°
C for
thick/large packages, and below 235
°
C for small/thin
packages.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
M
ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320
°
C.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| UBA2070P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:600 V CCFL ballast driver IC |
| UBA2070P/N1,112 | 功能描述:顯示驅動器和控制器 CCFL RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| UBA2070T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:600 V CCFL ballast driver IC |
| UBA2070T/N1,518 | 功能描述:顯示驅動器和控制器 IC CCFL DRIVER RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| UBA2070TD-T | 功能描述:IC CCFL DRIVER CONTROLLER 16SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 照明，鎮流器控制器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:CCFL 控制器 頻率:40 ~ 80 kHz 電流 - 電源:5mA 電流 - 輸出:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) 其它名稱:90-3991V+V01 |
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