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參數(shù)資料
| 型號： | UPC2782GR-E1 |
| 廠商： | NEC Corp. |
| 英文描述： | L BAND DOWN CONVERTER IC |
| 中文描述： | L波段向下轉(zhuǎn)換器IC |
| 文件頁數(shù)： | 19/20頁 |
| 文件大小： | 190K |
| 代理商： | UPC2782GR-E1 |
Data Sheet P11758EJ3V0DS00
19
μ
PC2782GR
Recommended Soldering Conditions
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document SEMI
CONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
μ
PC2782GR
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or below,
Reflow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°
C or below,
Flow time: 3 seconds or below,
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
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