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參數(shù)資料
| 型號(hào)： | V048K030T070 |
| 廠商： | Vicor Corporation |
| 元件分類(lèi)： | DC/DC變換器 |
| 英文描述： | VI Chip - VTM Voltage Transformation Module |
| 中文描述： | 六芯片- VTM電壓轉(zhuǎn)換模塊 |
| 文件頁(yè)數(shù)： | 1/15頁(yè) |
| 文件大小： | 473K |
| 代理商： | V048K030T070 |
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vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K030T070
Rev. 1.0
Page 1 of 15
PRELIMINARY
Product Description
The V048K030T070 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP, FPGA,
and ASIC at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 μs and delivers up to 70 A in a
volume of less than 0.25 in
3
with unprecedented
efficiency. It may be paralleled to deliver hundreds of
amps at an output voltage settable from 1.63 to 3.43
Vdc.
The VTM V048K030T070’s nominal output voltage is
3 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 1.63 to 3.43 Vdc at no load, and from
1.49 to 3.29 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/16, for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 3 V VTM achieves break-through current density of
284 A/in
3
in a VI Chip package compatible with standard
pick-and-place and surface mount assembly processes.
The VI Chip BGA package supports in-board mounting
with a low profile of 0.16" (4 mm) over the board.
A J-lead package option supports on-board surface
mounting with a profile of only 0.25" (6 mm) over the
board. The VTM’s fast dynamic response and low noise
eliminate the need for bulk capacitance at the load,
substantially increasing the POL density while improving
reliability and decreasing cost.
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
(1)
Values
-1.0 to 60
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 6.0
2,250
70
105
210
315
208
-40 to 125
-55 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
Storage temperature
-40 to 150
-65 to 150
°C
°C
T - Grade
M - Grade
VI Chip
Voltage Transformation Module
TM
– VTM
48 V to 3 V VI Chip Converter
70 A (105 A for 1 ms)
High density – 284 A/in
3
Small footprint – 60 A/in
2
Low weight – 0.5 oz (14 g)
Pick & Place / SMD
125°C operation
1 μs transient response
3.5 million hours MTBF
Typical efficiency 94%
No output filtering required
Surface mount BGA or J-Lead
packages
V048K030T070
Actual size
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=I
OUT
)
V
048
K
030
T
070
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
T
-40 to150
M
-65 to150
Operating
-40 to125
-55 to125
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Vf = 26- 55V
V
OUT
= 1.63- 3.43V
I
OUT
= 70A
K = 1/16
R
OUT
= 2.0m
max
Absolute Maximum Ratings
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