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參數資料
| 型號： | V300A3V3C264A3 |
| 英文描述： | DC to DC Converter |
| 中文描述： | DC至DC轉換器 |
| 文件頁數： | 1/8頁 |
| 文件大小： | 190K |
| 代理商： | V300A3V3C264A3 |
Vicor Corp.
Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
300V Maxi Family
Rev. 6.2
Page 1 of 8
Set your site on VICOR at www.vicorpower.com
Shown actual size:
4.6 x 2.2 x 0.5 in
117 x 56 x 12,7 mm
4
5
Absolute Maximum Ratings
Parameter
Baseplate to sink; flat, greased surface
Baseplate to sink; thermal pad (P/N 20263)
Baseplate to ambient
Baseplate to ambient; 1000 LFM
Thermal capacity
Min
Typ
0.08
0.07
4.9
1.1
165
Max
Unit
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Watt-sec/°C
Thermal Resistance and Capacity
Data Sheet
300V Input Maxi Family
*
DC-DC Converter Module
Features
DC input range: 180 - 375V
Input surge withstand: 400Vfor 100ms
DC output: 2V - 48V
Programmable output: 10 to 110%
Regulation: ±0.2% no load to full load
Efficiency: Up to 90%
Maximum operating temperature:
100°C at full load
Power density: Up to 100W/cubic inch
Height above board: 0.43 in. (10,9 mm)
Parallelable, with N+M fault tolerance
Low noise ZCS/ZVS architecture
Typical Applications:
off-line systems,
distributed power and electric vehicles
Product Overview
This DC-DC converter module uses
2nd Generation power processing, control
and packaging technologies to provide the
performance, flexibility and cost effectiveness
expected of a mature power component.
For example, a plated-cavity core transformer
couples widely separated primary and
secondary windings, resulting in low in-to-
out parasitic capacitance and noise.
High frequency ZCS/ZVS switching,
advanced power semiconductor packaging
and thermal management provide high
power density with low temperature
gradients. Extensive use of silicon
integration results in 1/3 the part count
of a 1st Generation converter.
Part Numbering
V 300 A 12 C 500 A
For pin styles see page 6. Slotted baseplate
(style 1) requires no designator. For
threaded baseplate add a
“
2
”
to the end of
the part number. For thru-hole, add a
“
3
”
.
See page 7 for dimensions.
Parameter
+In to
–
In voltage
+In to
–
In voltage
PC to
–
In voltage
PR to
–
In voltage
SC to
–
Out voltage
–
Sense to
–
Out voltage
Isolation voltage (in to out)
Isolation voltage (in to base)
Isolation voltage (out to base)
Storage temperature
Operating temperature
Pin soldering temperature
Pin soldering temperature
Mounting torque
Rating
-0.5 to +375
400
-0.5 to +7.0
-0.5 to +7.0
-0.5 to +1.5
1.0
3000
1550
500
-40 to +125
-20 to +100
500 (260)
750 (390)
5 (0.57)
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vrms
Vrms
Vrms
°
C
°
C
°
F (
°
C)
°
F (
°
C)
in-lbs (N-m)
Notes
<100ms
C-Grade
C-Grade
<5 sec;wave solder
<7 sec;hand solder
6 each, # 4-40 or M3
* The modules described here are the highest power for each output voltage.
Consult factory for availability of lower power units.
Input Voltage
24=24Vin
48=48Vin
300=300Vin
375=375Vin
A = Maxi
B = Mini
C = Micro
Output
Voltage
Product Grade Temperatures (°C)
Grade
Storage
C =
-
40 to +125
-
20 to +100
T =
-
40 to +125
-
40 to +100
H =
-
55 to +125
-
40 to +100
M =
-
65 to +125
-
55 to +100
Operating
Pin
Style
Base-
plate
Output
Power
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