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參數(shù)資料
| 型號： | VJ5601M868MXBSR |
| 廠商： | Vishay Vitramon |
| 文件頁數(shù)： | 3/5頁 |
| 文件大小： | 201K |
| 描述： | RF ANTENNA |
| 特色產(chǎn)品： | VJ5601M915 Series |
| 標準包裝： | 1 |
| 天線類型： | 芯片 |
| 頻帶數(shù)目： | 1 |
| 頻率： | 868MHz |
| 增益： | 3.2dBi |
| 端子： | 表面貼裝型 |
| 安裝類型： | 表面貼裝 |
| 高度（最大）： | 0.04"（1.2mm） |
| 包裝： | 標準包裝 |
| 其它名稱： | 720-1277-6 |
VJ5601M868MXBSR
www.vishay.com
Vishay Vitramon
Revision: 28-Mar-12
3
Document Number: 45209
For technical questions, contact: chipantenna@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FOOTPRINT, MECHANICAL AND PCB DIMENSIONS
The antenna footprint and mechanical dimensions are
presented in Figure 7. Optimal tuning is adjusted according
to PCB layout.
For additional mechanical support, it is recommended to
add one drop of heat curing epoxy glue.
" The glue dot should not overlap with any of the soldering
pads
" Apply the glue dot at the center of the antenna.
" The glue dot area secures the chip firmly to the PCB
Fig. 7 - Footprint, Chip Antenna Mechanical Dimensions, and PCB Layout Dimensions of VJ5601M868
Fig. 8 - Soldering IR Reflow with SnPb Solder
Fig. 9 - Soldering Reflow with Sn Solder
Time
30 s to 60 s
30 s to 60 s
30 s to 60 s
0
50
100
150
200
250
300
T
C)
> 215 癈: 20 s to 40 s
Max. temperature
Min. temperature
Sn-Pb eutectic solder paste
t (s)
0
50
100
150
200
250
300
T
(癈)
260 癈
50
100
150
200
250
245 癈
215 癈
180 癈
130 癈
40 s
10 s
10 s
2 K/s
?/DIV>
?/DIV>
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