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參數資料
| 型號： | VJ6040M011SXISRA0 |
| 廠商： | Vishay Vitramon |
| 文件頁數： | 4/6頁 |
| 文件大小： | 149K |
| 描述： | ANTENNA 470-860MHZ UHF SMD |
| 產品培訓模塊： | UHF Chip Antenna |
| 產品目錄繪圖： | VJ6040 |
| 特色產品： | VJ 6040 and VJ 3505 Chip Antennas |
| 標準包裝： | 1 |
| 天線類型： | 芯片 |
| 頻帶數目： | 1 |
| 頻率： | 470MHz ~ 860MHz |
| 增益： | -1dB |
| 端子： | 表面貼裝型 |
| 安裝類型： | 表面貼裝 |
| 高度（最大）： | 0.04"（1.2mm） |
| 包裝： | 標準包裝 |
| 產品目錄頁面： | 595 (CN2011-ZH PDF) |
| 其它名稱： | 720-1226-6 |
www.vishay.com
For technical questions, contact: mlcc@vishay.com
Document Number: 45157
4
Revision: 15-Jun-10
VJ 6040
Vishay Vitramon
VJ 6040 UHF Chip Antenna for Mobile Devices
FOOTPRINT AND MECHANICAL DIMENSIONS
The antenna footprint and mechanical dimensions are presented in figure 6. For mechanical support, it is recommended to add
one or two drops of heat curing epoxy glue. The glue dot should not overlap with any of the soldering pads. It is recommended
to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. For more details see VJ 6040 Assembly
Guidelines section below.
Fig. 6 - VJ 6040 Footprint
VJ 6040 ASSEMBLY GUIDELINES
1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown
below.
2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue
in the center of the footprint of the antenna prior to the antenna's soldering to the board should be done. An example for such
glue could be Heraeus PD 860002 SA. The weight of the dot should be 5 mg to 10 mg.
Fig. 7 - Soldering IR Reflow with SnPb Solder
Glue dot area
Time
30 s to 60 s
30 s to 60 s
30 s to 60 s
0
50
100
150
200
250
300
T
(癈)
> 215 癈: 20 s to 40 s
Max. temperature
Min. temperature
Sn-Pb eutectic solder paste
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