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參數資料
| 型號： | W24L11 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | TRANS NPN W/RES 210 HFE NS-B1 |
| 中文描述： | 128K的乘八高速CMOS靜態RAM |
| 文件頁數： | 9/11頁 |
| 文件大小： | 170K |
| 代理商： | W24L11 |
Preliminary W24L11
Publication Release Date: October 1999
- 9 -
Revision A1
PACKAGE DIMENSIONS
32-pin P-DIP
1. tie bar burrs.
2. are determined at the mold parting line.
4. protrusion/intrusion.
final visual inspection spec.
1.37
1.22
0.054
0.048
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.555
0.550
0.545
14.10
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
6. General appearance spec. should be based on
15
0
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
32-pin SOP Wide Body
1
17
32
16
y
e
D
S
Seating Plane
b
A
A
E H
L
L
E
E
1
c
e
1
1
e
A
2
See Detail F
Detail F
1. Dimensions D Max. & S include mold flash
3. Dimensions D & E i.
4. Controlling dimension: Inches
5. General appearance spec should be based
Notes:
0.20
0.15
0.008
0.006
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
b
c
D
E
e
H
E
L
L
E
S
y
θ
1
2
0.012
0.31
0.118
3.00
0.004
0.101
0.014
0.106
0.016
0.111
0.020
2.57
0.36
0.10
2.69
0.41
2.82
0.51
0.047
0.004
0
10
0.805
0.055
0.817
0.063
1.19
20.45
1.40
20.75
1.60
0.556
0.556
0.546
14.38
14.12
13.87
10
0
0.10
11.43
11.30
11.18
0.450
0.445
0.440
0.58
0.79
0.99
0.023
0.031
0.039
1.12
1.27
1.42
0.044
0.050
0.056
0.91
0.036
θ
相關PDF資料 |
PDF描述 |
|---|---|
| W24L11-70L | TRANS NPN W/RES 210 HFE NS-B1 |
| W24L11-70LL | 128K X 8 High Speed CMOS Static RAM |
| W24L11S-70L | TRANS NPN W/RES 30 HFE NS-B1 |
| W24L11S-70LL | TRANS NPN W/RES 30 HFE NS-B1 |
| W24L11T-70L | 128K X 8 High Speed CMOS Static RAM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W24L11-70L | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM |
| W24L11-70LL | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM |
| W24L11Q-70L | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM |
| W24L11Q-70LE | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SRAM |
| W24L11Q-70LL | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 High Speed CMOS Static RAM |
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