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參數資料
| 型號： | W55RFS27T1BH |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | SUPER-REGENERATION RF TRANSMITTER |
| 中文描述： | 超再生RF發射器 |
| 文件頁數： | 1/17頁 |
| 文件大小： | 345K |
| 代理商： | W55RFS27T1BH |
W55RFS27T1B Data Sheet
SUPER-REGENERATION RF TRANSMITTER
Publication Release Date:May 24, 2005
- 1 -
Revision A3
Table of Contents-
1.
GENERAL DESCRIPTION..................................................................................................................2
1.1
Features.....................................................................................................................................2
1.2
W55RFS27T1B Pad Definition...................................................................................................3
1.2.1
Pad Description...........................................................................................................................3
1.2.2
Clock Frequency Select (CKSEL) Setup.....................................................................................3
1.2.3
uC-Mode & Manual Mode (Baseband Data Rate) Setup ............................................................4
1.2.4
Baseband Encoder Control Function Description .......................................................................4
2.
SYSTEM DESCRIPTION.....................................................................................................................5
2.1
W55RFS27T1B System Block Diagram ....................................................................................5
2.2
W55RFS27T1B Functional Description.....................................................................................6
3.
ELECTRONIC CHARACTERISTICS...................................................................................................7
3.1
W55RFS27T1B Absolute Maximum Ratings.............................................................................7
3.2
W55RFS27T1B DC Characteristics...........................................................................................7
3.3
W55RFS27T1B Ordering Information........................................................................................8
3.4
W55RFS27T1B Package Information........................................................................................8
3.4.1
Bonding Pad List.........................................................................................................................8
3.4.2
Bonding Pad Diagram.................................................................................................................9
4.
DESIGN INFORMATION...................................................................................................................10
4.1
W55RFS27T1B Reference Design..........................................................................................10
4.1.1
TXOUT waveform .....................................................................................................................10
4.1.2
Application Circuit for 6 Control Functions................................................................................11
4.1.3
Application Circuit for 4 Control Functions................................................................................12
4.1.4
Application Circuit for FCC........................................................................................................14
4.2
uC-Mode Control Signal...........................................................................................................15
4.3
W55RFS27T Family FCC Certification....................................................................................16
5.
REVISION HISTORY.........................................................................................................................17
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