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參數(shù)資料
| 型號： | WED3C755E8M-300BM |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 1/13頁 |
| 文件大小： | 377K |
| 代理商： | WED3C755E8M-300BM |
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
April 2002 Rev. 6
Footprint compatible with WED3C750A8M-200BX
Footprint compatible with Motorola MPC 745
The WEDC 755/SSRAM multichip package is targeted for
high performance, space sensitive, low power systems and
supports the following power management features: doze,
nap, sleep and dynamic power management.
The WED3C7558M-XBX multichip package consists of:
755 RISC processor
Dedicated 1MB SSRAM L2 cache, configured as
128Kx72
21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
Core Frequency/L2 Cache Frequency (300MHz/
150MHz, 350MHz/175MHz)
Maximum 60x Bus frequency = 66MHz
The WED3C7558M-XBX is offered in Commercial (0°C to
+70°C), industrial (-40°C to +85°C) and military (-55°C to
+125°C) temperature ranges and is well suited for embed-
ded applications such as missiles, aerospace, flight com-
puters, fire control systems and rugged critical systems.
*This data sheet describes a product that s subject to change without notice.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WED3C755E8M350BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
| WED3C755E8M-350BC | 制造商:Microsemi Corporation 功能描述:755 MCM, 350 MHZ, 128K X 72 SSRAM, 175 MHZ, 255 BGA 21MM X 2 - Bulk |
| WED3C755E8M350BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
| WED3C755E8M-350BI | 制造商:Microsemi Corporation 功能描述:755 MCM, 350 MHZ, 128K X 72 SSRAM, 175 MHZ, 255 BGA 21MM X 2 - Bulk |
| WED3C755E8M350BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
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