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參數資料
型號: WEDF1M32B-70G2TC5
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: PROM
英文描述: 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
封裝: 4.60 MM HEIGHT, CERAMIC, QFP-68
文件頁數: 1/8頁
文件大小: 341K
代理商: WEDF1M32B-70G2TC5
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WEDF1M32B-XXX5
May 1999
Rev.1
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ADVANCED*
1Mx32 5V Flash Module
FEATURES
Access Times of 70, 90, 120ns
Packaging:
66 pin, PGA Type, 1.185” square, Hermetic
Ceramic HIP (Package 401)
68 lead, 22mm Low Prole CQFP, 4.6mm
(0.180”), (Package 509)
Sector Architecture
One 16KByte Sectors
Two 8KByte Sectors
One 32KByte Sectors
Fifteen 64KByte Sectors
1,000,000 Erase/Program Cycles
Organized as 1Mx32, user congurable as 2Mx16
or 4Mx8.
Commercial, Industrial and Military Temperature
Ranges
5V ± 10% for Read and Write Operations.
Low Power CMOS
Embedded Erase and Program Algorithm
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WEDF1M32B-XG2TX5 - 8 grams typical
WEDF1M32B-XHX5 - 13 grams typical
* This product is under development, is not qualied or characterized and is subject to
change or cancellation without notice.
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
RESET#
CS2#
GND
I/O11
A10
A9
A15
VCC
CS1#
A19
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
A17
WE#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4#
NC
I/O27
A4
A5
A6
NC
CS3#
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
PIN CONFIGURATION FOR WF1M32B-XHX5
Top View
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE#
Write Enable
CS1-4#
Chip Selects
OE#
Output Enable
RESET#
Reset
VCC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram
1M x 8
8
I/O0-7
CS1#
1M x 8
8
I/O8-15
CS2#
1M x 8
8
I/O16-23
CS3#
1M x 8
8
I/O24-31
CS4#
A0-19
OE#
WE#
RESET#
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