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參數資料
型號: WEDPS512K32LV-12BC
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PBGA143
封裝: 16 X 18 MM, PLASTIC, BGA-143
文件頁數: 1/7頁
文件大小: 268K
代理商: WEDPS512K32LV-12BC
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPS512K32V-XBX
June 2004
Rev. 5
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
Low Power Data Retention 'L' Option
TTL Compatible Inputs and Outputs
Fully Static Operation:
No clock or refresh required.
Three State Output.
This product is subject to change without notice.
FEATURES
Access Times of 12, 15, 17, 20ns
Packaging
143 PBGA, 16mm x 18mm, 288mm2
Organized as 512Kx32; User Congurable as
1Mx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
Low Voltage Operation:
3.3V ± 10% Power Supply
PIN CONFIGURATION FOR WEDPS512K32V-XBX
Pin Description
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram
WE1# CS1#
512K X 8
88
512K X 8
OE#
A0-18
I/O0 - 7
I/O8 - 15
I/O16 - 23
I/O24 - 31
WE2# CS2#WE3# CS3#WE4# CS4#
Top View
123456789
10
11
12
A
-
A2
A1
A0
GND
VCC
A18
A17
A16
GND
B
CS2#
A3
A4
D14
D15
NC
CS4#
D24
D25
OE#
A15
NC
C
D9
D8
NC
D12
D13
GND
VCC
D26
D27
WE4#
D31
D30
D
D10
D11
GND
VCC
D28
D29
E
WE2#
GND
VCC
NC
F
GND
VCC
G
VCC
GND
H
CS1#
VCC
GND
NC
J
D1
D0
VCC
GND
D23
D22
K
D2
D3
NC
D7
D5
VCC
GND
D17
D16
CS3#
D20
D21
L
WE1#
A6
A5
D6
D4
NC
WE3#
D19
D18
A14
A13
NC
M
GND
A7
A8
A9
vcc
GND
A10
A11
A12
vcc
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相關代理商/技術參數
參數描述
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