型號: | WEDPS512K32LV-12BC |
廠商: | WHITE ELECTRONIC DESIGNS CORP |
元件分類: | SRAM |
英文描述: | 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PBGA143 |
封裝: | 16 X 18 MM, PLASTIC, BGA-143 |
文件頁數: | 1/7頁 |
文件大小: | 268K |
代理商: | WEDPS512K32LV-12BC |
相關PDF資料 |
PDF描述 |
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WS128K32N-17H1QA | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
WS128K32N-20H1M | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
WS512K32N-25H2I | 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHMA66 |
WS512K32N-25H2M | 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHMA66 |
WPS1M36-25MSCSA | 1M X 36 MULTI DEVICE SRAM MODULE, 25 ns, SMA72 |
相關代理商/技術參數 |
參數描述 |
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WEDPS512K32LV-12BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
WEDPS512K32LV-12BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
WEDPS512K32LV-15BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
WEDPS512K32LV-15BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
WEDPS512K32LV-15BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |