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參數資料
型號: WEDPS512K32V-12BC
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PBGA143
封裝: 16 X 18 MM, PLASTIC, BGA-143
文件頁數: 1/7頁
文件大小: 126K
代理商: WEDPS512K32V-12BC
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPS512K32V-XBX
White Electronic Designs
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
n Low Power CMOS
n TTL Compatible Inputs and Outputs
n Fully Static Operation:
No clock or refresh required.
n Three State Output.
Note: This data sheet describes a product that is subject to change without notice.
FEATURES
n Access Times of 12, 15, 17, 20ns
n Packaging
143 PBGA , 16mm x 18mm, 288mm2
n Organized as 512Kx32; User Configurable as 1Mx16 or
2Mx8
n Commercial, Industrial and Military Temperature Ranges
n Low Voltage Operation:
3.3V ± 10% Power Supply
PIN CONFIGURATION FOR WEDPS512K32V-XBX
February 2003 Rev. 4
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
512K x 8
8
I/O0-7
WE CS
1
512K x 8
8
I/O8-15
WE CS
2
512K x 8
8
I/O16-23
WE CS
3
512K x 8
8
I/O24-31
WE CS
4
A0-18
OE
TOP VIEW
12
34
5
6
7
8
9
10
11
12
A
-
A2
A1
A0
GND
V CC
A18
A17
A16
GND
B
CS2
A 3
A 4
D14
D15
NC
CS4
D24
D25
O E
A15
NC
C
D 9
D 8
NC
D12
D13
GND
V CC
D26
D27
WE4
D31
D30
D
D 1 0
D 1 1
GND
V CC
D28
D29
E
WE2
GND
V CC
NC
F
GND
V CC
G
V CC
GND
H
CS1
V CC
GND
N C
J
D1
D0
V CC
GND
D 2 3
D 2 2
K
D2
D3
N C
D7
D5
V CC
GND
D17
D16
CS3
D20
D21
L
WE1
A 6
A 5
D 6
D 4
N C
WE3
D 1 9
D 1 8
A14
A13
N C
M
GND
A7
A8
A9
V CC
GND
A10
A11
A12
V CC
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