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參數資料
型號: WF4M32-120G4TC5A
元件分類: PROM
英文描述: 4M X 32 FLASH 5V PROM MODULE, 120 ns, CQFP68
封裝: CERAMIC, LQFP-68
文件頁數: 1/15頁
文件大小: 233K
代理商: WF4M32-120G4TC5A
1
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
HI-RELIABILITY PRODUCT
WF4M32-XXX5
May1999 Rev. 2
I/O0-31
Data Inputs/Outputs
A0-21
Address Inputs
WE
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
RESET
Reset
FIG. 1 PIN CONFIGURATION FOR WF4M32-XH2X5
PIN DESCRIPTION
TOP VIEW
4MX32 5V FLASH MODULE, SMD 5962-97612 (pending) PRELIMINARY*
FEATURES
s Access Times of 100, 120, 150ns
s Packaging:
66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP
(Package 402).
68 lead, 40mm Low Profile CQFP ( Package 502 ), 3.5mm
(0.140") height.
68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3)
s Sector Architecture
32 equal size sectors of 64KBytes per each 2Mx8 chip
Any combination of sectors can be erased. Also supports
full chip erase.
s Minimum 100,000 Write/Erase Cycles Minimum
s Organized as 4Mx32
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
RESET
CS2
GND
I/O11
A10
A9
A15
VCC
CS1
A19
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A17
WE
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
A21
A13
A8
I/O16
I/O17
I/O18
VCC
CS4
NC
I/O27
A4
A5
A6
A20
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
I/O 0-7
CS1
I/O 8-15
CS2
I/O 16-23
CS3
I/O 24-31
CS
OE
A 0-20
4
A 21
2M x 8
2Mx 8
2M x 8
WE
RESET
BLOCK DIAGRAM
s User configurable as 8Mx16 or 16Mx8 in HIP and G4T
packages.
s Commercial, Industrial, and Military Temperature Ranges
s 5 Volt Read and Write. 5V
± 10% Supply.
s Low Power CMOS
s Data Polling and Toggle Bit feature for detection of program
or erase cycle completion.
s Supports reading or programming data to a sector not being
erased.
s RESET pin resets internal state machine to the read mode.
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation, Separate Power and Ground Planes to
improve noise immunity
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
Note: For programming information refer to Flash Programming 16M5
Application Note.
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