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參數資料
| 型號： | WF4M32-150H2E5A |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 4M X 32 FLASH 5V PROM MODULE, 150 ns, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, HERMETICALLY SEALED, CERAMIC, HIP-66 |
| 文件頁數： | 1/15頁 |
| 文件大小： | 258K |
| 代理商： | WF4M32-150H2E5A |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF4M32-XXX5
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
RESET
CS2
GND
I/O11
A10
A9
A15
VCC
CS1
A19
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A17
WE
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
A21
A13
A8
I/O16
I/O17
I/O18
VCC
CS4
NC
I/O27
A4
A5
A6
A20
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
December 2003 Rev. 5
I/O0-31 Data Inputs/Outputs
A0-21
Address Inputs
WE
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
RESET
Reset
FIG. 1
PIN CONFIGURATION FOR WF4M32-XH2X5
PIN DESCRIPTION
TOP VIEW
4MX32 5V FLASH MODULE
FEATURES
! Access Times of 100, 120, 150ns
! Packaging:
66 pin, PGA Type, 1.385" square, Hermetic
Ceramic HIP (Package 402).
68 lead, 40mm Low Profile CQFP ( Package
502 ), 3.5mm (0.140") height.
68 lead, Hermetic CQFP (G2T), 22.4mm
(0.880") square (Package 509) 4.57mm
(0.180") height. Designed to fit JEDEC 68
lead 0.990CQFJ footprint (Fig. 3)
! Sector Architecture
32 equal size sectors of 64KBytes per each
2Mx8 chip
Any combination of sectors can be erased. Also
supports full chip erase.
! Minimum 100,000 Write/Erase Cycles Minimum
BLOCK DIAGRAM
! Organized as 4Mx32
! User configurable as 8Mx16 or 16Mx8 in HIP and
G4T packages.
! Commercial, Industrial, and Extended
Temperature Ranges
! 5 Volt Read and Write. 5V ± 10% Supply.
! Low Power CMOS
! Data Polling and Toggle Bit feature for detection
of program or erase cycle completion.
! Supports reading or programming data to a
sector not being erased.
! RESET pin resets internal state machine to the
read mode.
! Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation, Separate Power
and Ground Planes to improve noise immunity
PRELIMINARY*
*This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
Note:
For programming information refer to Flash Programming 16M5
Application Note.
I/O 0-7
CS1
I/O 8-15
CS2
I/O 16-23
CS3
I/O 24-31
CS
OE
A 0-20
4
A 21
2M x 8
2Mx 8
2M x 8
WE
RESET
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PDF描述 |
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| WE128K32P-200H1QA | 128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 |
| WMS256K16L-35DLIA | 256K X 16 STANDARD SRAM, 35 ns, CDSO44 |
| WMS256K16L-20DLIA | 256K X 16 STANDARD SRAM, 20 ns, CDSO44 |
| WMS256K16-20DLI | 256K X 16 STANDARD SRAM, 20 ns, CDSO44 |
| WE128K32NP-150H1MA | 128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| WF4M32-150H2I5 | 制造商:Microsemi Corporation 功能描述:4M X 32 FLASH MODULE, 5V, 150NS, 66 PGA 1.385" SQ., INDUSTRI - Bulk |
| WF4M32-150H2I5A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:4Mx32 5V FLASH MODULE |
| WF4M32-150H2M5 | 制造商:Microsemi Corporation 功能描述:4M X 32 FLASH MODULE, 5V, 150NS, 66 PGA 1.385" SQ., MIL-SCRE - Bulk |
| WF4M32-150H2M5A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:4Mx32 5V FLASH MODULE |
| WF4M32-XG2TX5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Flash MCP |
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