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參數資料
| 型號： | WF512K32N-150H1C5 |
| 元件分類： | PROM |
| 英文描述： | 512K X 32 FLASH 5V PROM MODULE, 150 ns, CHIP66 |
| 封裝： | HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數： | 1/15頁 |
| 文件大小： | 269K |
| 代理商： | WF512K32N-150H1C5 |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
FEATURES
s Access Times of 60, 70, 90, 120, 150ns
s Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400(1))
68 lead, 40mm, Low Capacitance Hermetic CQFP
(Package 501)
68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP
(Package 502)
68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")
square (Package 510), 3.56mm (0.140") high.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint
(Fig. 3)
s 100,000 Erase/Program Cycles Minimum
s Sector Architecture
8 equal size sectors of 64KBytes each
Any combination of sectors can be concurrently erased.
Also supports full chip erase
s Organized as 512Kx32
s Commercial, Industrial and Military Temperature Ranges
s 5 Volt Programming. 5V
± 10% Supply.
s Low Power CMOS, 6.5mA Standby
s Embedded Erase and Program Algorithms
s TTL Compatible Inputs and CMOS Outputs
s Built-in Decoupling Caps for Low Noise Operation
s Page Program Operation and Internal Program Control Time
s Weight
WF512K32-XG2UX5 - 8 grams typical
WF512K32-XH1X5 - 13 grams typical
WF512K32-XG4X5 - 20 grams typical
WF512K32-XG4TX5 - 20 grams typical
1. Call factory for PGA type (HIP) package options.
Note: See Flash Programming Application Note 4M5 for algorithms.
WF512K32-XXX5
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A9
A15
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A17
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A4
A5
A6
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
TOP VIEW
BLOCK DIAGRAM
512K x 8
8
I/O 0-7
WE CS
1
512K x 8
8
I/O 8-15
WE CS
2
512K x 8
8
I/O 16-23
WE CS
3
512K x 8
8
I/O 24-31
WE CS
4
A 0- 18
OE
FIG. 1 PIN CONFIGURATION FOR WF512K32N-XH1X5
512Kx32 5V FLASH MODULE, SMD 5962-94612
January 2001 Rev. 3
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| WS128K32L-25G2TI | 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WF512K32-120G4TQ5 | 512K X 32 FLASH 5V PROM MODULE, 120 ns, CQFP68 |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| WF512K32N-150H1C5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 5V FLASH MODULE, SMD 5962-94612 |
| WF512K32N-150H1I5 | 制造商:Microsemi Corporation 功能描述:512K X 32 FLASH MODULE, 5V, 150NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WF512K32N-150H1I5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 5V FLASH MODULE, SMD 5962-94612 |
| WF512K32N-150H1M5 | 制造商:Microsemi Corporation 功能描述:512K X 32 FLASH MODULE, 5V, 150NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WF512K32N-150H1M5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 5V FLASH MODULE, SMD 5962-94612 |
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