
●
●
●
▲
{
{
{
Absolute Maximum Ratings
(
*
Drain current limited by junction temperature)
Symbol
Parameter
Value
Units
V
DSS
Drain to Source Voltage
400
V
I
D
Continuous Drain Current(@T
C
= 25
°C)
6.0*
A
Continuous Drain Current(@T
C
= 100
°C)
3.6*
A
I
DM
Drain Current Pulsed
(Note 1)
24*
±
30
A
V
GS
Gate to Source Voltage
V
E
AS
E
AR
dv/dt
Single Pulsed Avalanche Energy
(Note 2)
390
mJ
Repetitive Avalanche Energy
(Note 1)
8.75
mJ
Peak Diode Recovery dv/dt
(Note 3)
5.5
V/ns
P
D
Total Power Dissipation(@T
C
= 25 °C)
38
W
Derating Factor above 25 °C
0.3
W/°C
T
STG,
T
J
Operating Junction Temperature & Storage Temperature
- 55 ~ 150
°C
T
L
Maximum Lead Temperature for soldering purpose,
1/8 from Case for 5 seconds.
300
°C
Thermal Characteristics
Symbol
Parameter
Value
Typ.
Units
Min.
Max.
R
θ
JC
R
θ
JA
Thermal Resistance, Junction-to-Case
-
-
3.31
°C/W
Thermal Resistance, Junction-to-Ambient
-
-
62.5
°C/W
WFF730
Features
■
R
DS(on)
(Max 0.95
)@V
GS
=10V
■
Gate Charge
(Typical 25nC)
■
Improved dv/dt Capability, High Ruggedness
■
100% Avalanche Tested
■
Maximum Junction Temperature Range
(150°C)
General Description
This Power MOSFET is produced using Wisdom’s advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a high
rugged avalanche characteristics. These devices are well suited
for high efficiency switching DC/DC converters, switch mode power
supply, DC-AC converters for uninterruped power supply, motor
control.
N-Channel MOSFET
Wisdom
Semiconductor
Symbol
2. Drain
3. Source
1. Gate
TO-220F
1
2
3