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參數資料
| 型號： | WLP200 |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | WAFER LEVEL PACKAGE EVALUATION RC FILTER NETWORK |
| 中文描述： | 晶圓級封裝評價RC濾波器網絡 |
| 文件頁數： | 1/6頁 |
| 文件大小： | 80K |
| 代理商： | WLP200 |
2000 California Micro Devices Corp. All rights reserved.
11/10/2000
1
WLP200
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Wafer Level Package Evaluation RC Filter Network
Features
6 Filters per device
Ultra small footprint, 0.5mm pitch
Silicon substrate
0.30mm Eutectic Solder Bumps
Product Description
The WLP200 consists of 6 RC filters with different filter
characteristics in a wafer level package (WLP). All
I/O pins are ESD protected for contact discharges up to
8KV per the IEC1000-4-2 level 4 specification. Two
versions with different capacitor values are available.
Cellular phone application frequently demands filtering
of signals in the 800 to 2,700 MHz band. California
Micro Devices’ unique thin film Flip Chip filters provide a
minimum of –30 dB of attenuation over this frequency
Applications
EMI filter for Mobile Equipment
(e.g. Cellular Phones)
Evaluation Device
C1460800
SCHEMATIC DIAGRAM
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
techniques. Ground-bounce and cross-talk are mini-
mized by a die design that provides eight solder bump
contacts to the common supply connection. The solder
bump contacts are a 63/37 Sn/Pb alloy and are nomi-
nally 0.30 mm in diameter.
R 50
C
GND
R 50
R 90
C
GND
R 90
R 70
C
GND
R 70
R 50
C
GND
R 90
C
GND
R 70
C
GND
GND
C1
D1
D2
D3
D4
D5
B1
A1
A2
A3
A4
A5
C3
B3
C2
B2
C5
B5
C4 B4
GND
GND
GND
GND
GND
GND
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