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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
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Commercial, Industrial and Military Temperature
Ranges
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5 Volt Power Supply
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Low Power CMOS
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TTL Compatible Inputs and Outputs
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Built in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
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Weight:
WS128K32-XG1UX - 5 grams typical
WS128K32-XG2TX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
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All devices are upgradeable to 512Kx32
FEATURES
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Access Times of 15, 17, 20, 25, 35, 45, 55ns
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MIL-STD-883 Compliant Devices Available
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Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400)
68 lead, 40mm CQFP (G4T), 3.56mm (0.140")
(Package 502).
68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),
(Package 509)
68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm
(0.140"), (Package 519)
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Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
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Low Power Data Retention - only available in G2T
package type
PIN DESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
Address Inputs
WE
1-4
Write Enables
CS
1-4
Chip Selects
OE
Output Enable
V
CC
Power Supply
GND
NC
Not Connected
Ground
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
11 22 33 44 55 66
1 12 23 34 45 56
TOP VIEW
BLOCK DIAGRAM
128K x 8
8
I/O
0-7
CS
1
1
128K x 8
8
I/O
8-15
2
128K x 8
8
I/O
16-23
3
128K x 8
8
I/O
24-31
4
A
0-16
OE
WE
CS
2
WE
CS
3
WE
CS
4
WE
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
January 2001 Rev. 7