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參數(shù)資料
| 型號： | WS1M32V-17G3C |
| 英文描述： | 1Mx32 SRAM 3.3V MODULE |
| 中文描述： | 1Mx32 SRAM的3.3模塊 |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 315K |
| 代理商： | WS1M32V-17G3C |
WS1M32V-XG3X
PRELIMINARY*
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
February, 2001
Rev. 5
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9
V
CC
A
0
A
1
A
2
A
3
A
4
A
5
A
6
OE#
1
OE#
2
OE#
3
OE#
4
NC
A
7
A
8
A
9
A
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A
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A
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A
13
GND
V
C
I
0
I
1
I
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I
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I
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I
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C
1
N
C
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9
I
1
I
1
I
1
I
1
I
1
I
1
G
GND
NC
NC
NC
NC
NC
NC
NC
NC
WE#
4
WE#
3
WE#
2
WE#
1
NC
NC
A
18
A
17
A
16
A
15
A
14
V
CC
G
I
3
I
3
I
2
I
2
I
2
I
2
I
2
I
2
N
N
N
I
2
I
2
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2
I
2
I
1
I
1
I
1
I
1
V
C
8
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1 84 83 82 81 80 79 78 77
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45 46 47 48 49 50 51 52 53
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1Mx32 SRAM 3.3V MODULE
FEATURES
Access Times of 17, 20, 25ns
84 lead, 28mm CQFP, (Package 511)
Organized as two banks of 512Kx32, User
Configurable as 2Mx16 or 4Mx8
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
PIN CONFIGURATION FOR WS1M32V-XG3X
TOP VIEW
PIN DESCRIPTION
I/O0-31
A0-18
WE#1-4
CS#1-2
OE#1-4
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enables
+3.3V Power Supply
Ground
Not Connected
3.3V Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight - WS1M32V-XG3X - 20 grams typical
*This product is under development, is not qualified or characterized and is subject to
change without notice.
BLOCK DIAGRAM
8
I/O0-7
CS#1
A0-18
I/O8-15
CS#2
I/O16-23
I/O24-31
WE#1
8
512K x 8
8
512K x 8
8
512K x 8
512K x 8
512K x 8
512K x 8
512K x 8
512K x 8
OE#1
WE#2
OE#2
WE#3
OE#3
WE#4
OE#4
Note: CS#1& CS#2 are used as bank select
The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead
CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the
CQFP form.
1.146"
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS1M32V-17G3CA | 1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3I | 1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3IA | 1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3M | 1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3MA | 1Mx32 SRAM 3.3V MODULE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS1M32V-17G3CA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3I | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3IA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3M | 制造商:Microsemi Corporation 功能描述:1M X 32 SRAM MODULE, - Bulk |
| WS1M32V-17G3MA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
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