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參數資料
| 型號： | WS512K32NV-70G2TI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CQFP68 |
| 封裝： | HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁數： | 1/8頁 |
| 文件大小： | 378K |
| 代理商： | WS512K32NV-70G2TI |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32V-XXX
February 2000
Rev. 2
ADVANCED*
512Kx32 SRAM 3.3V MODULE
TTL Compatible Inputs and Outputs
Low Voltage Operation:
3.3V ± 10% Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32V-XHX - 13 grams typical
* This product is under development, is not qualied or characterized and is subject to
change or cancellation without notice.
FEATURES
Access Times of 70, 85, 100, 120ns
Packaging
66-pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
68 lead, Hermetic CQFP (G2T), 22.4mm (0.880
inch), 4.57mm (0.180") high (Package 510).
Designed to t JEDEC 68 lead 0.990" CQFJ
footprint
Organized as 512Kx32; User Congurable as
1024Kx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
PIN CONFIGURATION FOR WS512K32NV-XHX
Pin Description
Top View
Block Diagram
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2#
CS2#
GND
I/O11
A10
A11
A12
VCC
CS1#
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
A18
WE1#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4#
WE4#
I/O27
A3
A4
A5
WE3#
CS3#
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
WE1#CS1#CS2#CS3#CS4#
WE4#
WE3#
WE2#
512K x 8
OE#
A0-18
I/O0-7
I/O24-31
I/O16-23
I/O8-15
88
8
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
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