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參數資料
型號: XC3S200A-4FGG320C
廠商: Xilinx Inc
文件頁數: 1/2頁
文件大小: 0K
描述: IC SPARTAN-3A FPGA 200K 320FBGA
產品培訓模塊: Extended Spartan 3A FPGA Family
標準包裝: 84
系列: Spartan®-3A
LAB/CLB數: 448
邏輯元件/單元數: 4032
RAM 位總計: 294912
輸入/輸出數: 248
門數: 200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 320-BGA
供應商設備封裝: 320-FBGA(19x19)
其它名稱: 122-1544
The Programmable Logic
Challenge of I/O Intensive
Designs
Traditional FPGAs are proportionate
between logic and I/O not being cost-
effective for I/O intensive designs
System designers need to quickly adapt
to fast-evolving I/O standards
High volume consumer applications
require low-cost and robust security
solutions
The Xilinx FPGA Solution
The Spartan-3A FPGAs were designed
for applications where I/O count and
capabilities matter more than logic density
The Spartan-3A platform delivers up to
502 I/Os with support for industry-leading
26 popular and emerging I/O standards
The industry’s first 90nm FPGA electronic
ID - Device DNA serial number provides
a cost-effective, robust mechanism to help
protect against reverse-engineering,
cloning and overbuilding
Xilinx is driving the multiple domain-optimized platforms for highly efficient and
optimal design solutions, instead of forcing inefficient, one-size-fits-all solutions on
significantly varying application requirements.
Spartan-3A Platform Key Features
Standard Low-Cost Features
The Spartan-3A FPGA platform is a full feature platform of five devices with
system gates ranging from 50K to 1.4M gates, and I/Os ranging from 108 to 502
I/Os, with density migration. The Spartan-3A FPGAs also support up to 576 Kbits of
fast-block RAM with byte-write enable, and up to 176 Kbits of distributed RAM.
Additionally, there are built-in multipliers for efficient DSP implementation and
Digital Clock Managers (DCMs) for system level clock management functions.
Advance Features
The advance features in the Spartan-3A platform include unique Device DNA
serial number, support for 26 I/O standards, enhanced Multi-Boot capability
with watchdog timer, dual power management modes, and Dynamic Input
Delay for precise data-to-clock centering. These advance features significantly
help shorten design cycles and lower system cost.
SPARTAN-3 GENERATION FPGAs
Xilinx Spartan
-3A FPGA Platform
The World’s Lowest-Cost I/O Optimized FPGAs
相關PDF資料
PDF描述
EB43-S0C5060X CONN EDGEBOARD DUAL 100POS 3A
XC3S200-4TQG144I SPARTAN-3A FPGA 200K STD 144TQFP
EBM12DTAI-S189 CONN EDGECARD 24POS R/A .156 SLD
XC3S500E-5PQG208C IC FPGA SPARTAN-3E 500K 208-PQFP
ACM36DRTN-S13 CONN EDGECARD EXTEND 72POS 0.156
相關代理商/技術參數
參數描述
XC3S200A-4FGG320I 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數:3411 邏輯元件/單元數:43661 RAM 位總計:2138112 輸入/輸出數:358 門數:- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3S200A-4FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數:3411 邏輯元件/單元數:43661 RAM 位總計:2138112 輸入/輸出數:358 門數:- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3S200A-4FT256I 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數:3411 邏輯元件/單元數:43661 RAM 位總計:2138112 輸入/輸出數:358 門數:- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3S200A-4FTG256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A 標準包裝:60 系列:XP LAB/CLB數:- 邏輯元件/單元數:10000 RAM 位總計:221184 輸入/輸出數:244 門數:- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
XC3S200A-4FTG256C4124 制造商:Xilinx 功能描述:
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