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參數資料
| 型號： | XC3SD3400A-4CSG484C |
| 廠商： | Xilinx Inc |
| 文件頁數： | 4/7頁 |
| 文件大小： | 0K |
| 描述： | SPARTAN-3ADSP FPGA 3400K 484CSA |
| 產品培訓模塊： | Extended Spartan 3A FPGA Family |
| 標準包裝： | 84 |
| 系列： | Spartan®-3A DSP |
| LAB/CLB數： | 5968 |
| 邏輯元件/單元數： | 53712 |
| RAM 位總計： | 2322432 |
| 輸入/輸出數： | 309 |
| 門數： | 3400000 |
| 電源電壓： | 1.14 V ~ 1.26 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 484-FBGA，CSPBGA |
| 供應商設備封裝： | 484-CSPBGA |
| 配用： | 122-1532-ND - KIT DEVELOPMENT SPARTAN 3ADSP |
| 其它名稱： | 122-1540 |
Extended Spartan-3A Family Overview
DS706 (v1.1) February 2, 2011
Product Specification
4
R
Package Marking
Figure 1 provides a top marking example for the Extended
Spartan-3A family in the quad-flat packages. Figure 2
shows the top marking for the Extended Spartan-3A family
in BGA packages. The markings for the BGA packages are
nearly identical to those for the quad-flat packages, except
that the marking is rotated with respect to the ball A1
indicator.
The “5C” and “4I” Speed Grade/Temperature Range part
combinations might be dual marked as “5C/4I”.
Table 2: Available User I/Os
Device
VQ100
VQG100
TQ144
TQG144
FT256
FTG256
FG320
FGG320
FG400
FGG400
CS484
CSG484
FG484
FGG484
FG676
FGG676
Body Size (mm)
14x14(1)
20x20(1)
17 x 17
19 x 19
21 x 21
19 x 19
23 x 23
27 x 27
XC3S50A/AN
68(2)
108
144
-
XC3S200A/AN
68(2)
-
195
248(2)
-
XC3S400A/AN
-
195
251(2)
311
-
XC3S700A/AN
-
161(2)
-
311(2)
-372
-
XC3S1400A/AN
-
161(2)
-
375
502
XC3SD1800A
-
----
309
-
519
XC3SD3400A
-
----
309
-
469
Notes:
1.
The footprints for the VQ/TQ packages are larger than the package body. See the package drawings
2.
These options are available only in the Spartan-3A devices, not the Spartan-3AN devices. See the data sheets for each device for Pb and
Pb-free package option availability.
X-Ref Target - Figure 1
Figure 1: Extended Spartan-3A Device QFP Package Marking Example
X-Ref Target - Figure 2
Figure 2: Extended Spartan-3A Device BGA Package Marking Example
Date Code
Mask Revision Code
Process Technology
XC3S50A
TM
TQ144AGQ0625
D1234567A
4C
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
Fabrication Code
Pin P1
R
DS706_01_072508
Lot Code
Date Code
XC3S50A
TM
4C
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
DS706_02_072508
FT256 AGQ0625
D1234567A
Mask Revision Code
Process Code
Fabrication Code
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相關代理商/技術參數 |
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| XC3SD3400A-4CSG484I | 功能描述:IC FPGA SPARTAN-3A DSP 484-CSBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC3SD3400A-4CSG484LI | 功能描述:IC FPGA SPARTAN 3 DSP 484CSGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Spartan®-3A DSP 標準包裝:60 系列:XP LAB/CLB數:- 邏輯元件/單元數:10000 RAM 位總計:221184 輸入/輸出數:244 門數:- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA（23x23） 其它名稱:220-1241 |
| XC3SD3400A-4FG676C | 制造商:Xilinx 功能描述:FPGA SPARTAN-3A 3.4M GATES 53712 CELLS 667MHZ 1.2V 676FBGA - Trays 制造商:Xilinx 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA 制造商:Xilinx 功能描述:IC FPGA 469 I/O 676FBGA |
| XC3SD3400A-4FG676CES | 制造商:Xilinx 功能描述: |
| XC3SD3400A-4FG676I | 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
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