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參數資料
| 型號： | XC4013XL-3BG256I |
| 廠商： | XILINX INC |
| 元件分類： | FPGA |
| 英文描述： | XC4000E and XC4000X Series Field Programmable Gate Arrays |
| 中文描述： | FPGA, 576 CLBS, 10000 GATES, 166 MHz, PBGA256 |
| 文件頁數： | 1/16頁 |
| 文件大小： | 69K |
| 代理商： | XC4013XL-3BG256I |
R
DS005 (v. 1.8 October 18, 1999 - Product Specication
6-73
XC4000E and XC4000X Series Field Programmable Gate Arrays
6
XC4000XL Electrical Specications
Denition of Terms
In the following tables, some specications may be designated as Advance or Preliminary. These terms are dened as
follows:
Advance:
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or
devicefamilies. Values are subject to change. Use as estimates, not for production.
Preliminary:
Based on preliminary characterization. Further changes are not expected.
Unmarked:
Specications not identied as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the a.c. parameter delay specications included in this document are
derived from measuring internal test patterns. All specications are representative of worst-case supply voltage and junction
temperature conditions.
All specications subject to change without notice.
XC4000XL D.C. Characteristics
Absolute Maximum Ratings
Recommended Operating Conditions
Description
Units
VCC
Supply voltage relative to Ground
-0.5 to 4.0
V
VIN
Input voltage relative to Ground (Note 1)
-0.5 to 5.5
V
VTS
Voltage applied to 3-state output (Note 1)
-0.5 to 5.5
V
VCCt
Longest Supply Voltage Rise Time from 1 V to 3V
50
ms
TSTG
Storage temperature (ambient)
-65 to +150
°C
TSOL
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
+260
°C
TJ
Junction Temperature
Ceramic packages
+150
°C
Plastic packages
+125
°C
Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to
achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toVCC +2.0 V, provided this over or
undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
Symbol
Description
Min
Max
Units
VCC
Supply voltage relative to Gnd, TJ = 0 °C to +85°C
Commercial
3.0
3.6
V
Supply voltage relative to Gnd, TJ = -40°C to +100°C Industrial
3.0
3.6
V
VIH
High-level input voltage
50% of VCC
5.5
V
VIL
Low-level input voltage
0
30% of VCC
V
TIN
Input signal transition time
250
ns
Notes:
At junction temperatures above those listed above, all delay parameters increase by 0.35% per
°C.
Input and output measurement threshold is ~50% of VCC.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| XC4013XL-3BG256M | 制造商:XILINX 制造商全稱:XILINX 功能描述:XC4000E and XC4000X Series Field Programmable Gate Arrays |
| XC4013XL-3HT144C | 功能描述:IC FPGA C-TEMP 3.3V 3SPD 144HQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:XC4000E/X 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XC4013XL-3HT144I | 功能描述:IC FPGA I-TEMP 3.3V 3SPD 144HQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:XC4000E/X 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XC4013XL-3HT144M | 制造商:XILINX 制造商全稱:XILINX 功能描述:XC4000E and XC4000X Series Field Programmable Gate Arrays |
| XC4013XL-3HT176C | 功能描述:IC FPGA C 3.3V 3SPD 176HTQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:XC4000E/X 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
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