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參數資料
型號: XCR3064XL-6VQ100C
廠商: Xilinx Inc
文件頁數: 1/12頁
文件大小: 0K
描述: IC CPLD 64 MACROCEL HP 100-VQFP
標準包裝: 90
系列: CoolRunner XPLA3
可編程類型: 系統內可編程(最少 1K 次編程/擦除循環)
最大延遲時間 tpd(1): 5.5ns
電壓電源 - 內部: 3 V ~ 3.6 V
邏輯元件/邏輯塊數目: 4
宏單元數: 64
門數: 1500
輸入/輸出數: 68
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-TQFP
供應商設備封裝: 100-VQFP(14x14)
包裝: 托盤
DS012 (v2.5) May 26, 2009
1
Product Specification
2000–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. All other trademarks are the property of their respective owners.
Features
Fast Zero Power (FZP) design technique provides
ultra-low power and very high speed
-
Typical Standby Current of 17 to 18
μA at 25°C
Innovative CoolRunner XPLA3 architecture
combines high speed with extreme flexibility
Based on industry's first TotalCMOS PLD — both
CMOS design and process technologies
Advanced 0.35
μ five layer metal EEPROM process
-
1,000 erase/program cycles guaranteed
-
20 years data retention guaranteed
3V, In-System Programmable (ISP) using JTAG IEEE
1149.1 interface
-
Full Boundary-Scan Test (IEEE 1149.1)
-
Fast programming times
Support for complex asynchronous clocking
-
16 product term clocks and four local control term
clocks per function block
-
Four global clocks and one universal control term
clock per device
Excellent pin retention during design changes
Available in commercial grade and extended voltage
(2.7V to 3.6V) industrial grade
5V tolerant I/O pins
Input register setup time of 2.5 ns
Single pass logic expandable to 48 product terms
High-speed pin-to-pin delays of 5.0 ns
Slew rate control per output
100% routable
Security bit prevents unauthorized access
Supports hot-plugging capability
Design entry/verification using Xilinx or industry
standard CAE tools
Innovative Control Term structure provides:
-
Asynchronous macrocell clocking
-
Asynchronous macrocell register preset/reset
-
Clock enable control per macrocell
Four output enable controls per function block
Foldback NAND for synthesis optimization
Universal 3-state which facilitates "bed of nails" testing
Available in Chip-scale BGA, Fineline BGA, and QFP
packages. Pb-free available for most package types.
See Xilinx Packaging for more information.
0
CoolRunner XPLA3 CPLD
DS012 (v2.5) May 26, 2009
014
Product Specification
R
Table 1: CoolRunner XPLA3 Device Family
XCR3032XL
XCR3064XL
XCR3128XL
XCR3256XL
XCR3384XL
XCR3512XL
Macrocells
32
64
128
256
384
512
Usable Gates
750
1,500
3,000
6,000
9,000
12,000
Registers
32
64
128
256
384
512
TPD (ns)
4.55.5
5.57.0
7.0
TSU (ns)
3.0
3.5
4.3
3.8
TCO (ns)
3.5
4
4.5
5.0
Fsystem (MHz)
213
192
175
154
135
ICCSB (μA)
17
18
Table 2: CoolRunner XPLA3 Packages and User I/O Pins
XCR3032XL
XCR3064XL
XCR3128XL
XCR3256XL
XCR3384XL
XCR3512XL
44-pin VQFP
36
-
48-pin 0.8mm CSP
36
40
-
56-pin 0.5mm CSP
-
48
-
100-pin VQFP
-
68
84
-
144-pin 0.8mm CSP
-
108
-
144-pin TQFP
-
108
120
118(1)
-
208-pin PQFP
-
164
172
180
256-pin Fineline BGA
-
164
212
280-pin 0.8mm CSP
-
164
-
324-pin Fineline BGA
-
220
260
1.
XCR3384XL TQ144 JTAG pins are not compatible with other members of the CoolRunner XPLA3 family in the TQ144 package.
2.
Most packages are available in Pb-Free option. See individual data sheets for more details.
3.
The 44-pin PLCC package is discontinued per XCN07022.
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