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參數(shù)資料
| 型號(hào)： | YFS-30-03-H-10-MSB-TR |
| 廠商： | SAMTEC INC |
| 元件分類： | 插座 |
| 英文描述： | BGA300, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 801K |
| 代理商： | YFS-30-03-H-10-MSB-TR |
DO NOT
SCALE FROM
THIS PRINT
YFS-XX-X3-X-XX-XSB-XX
No OF POSITIONS
-20, -30, -40, -50
(PER ROW)
ROW SPECIFICATION
-05: FIVE (USE YFSP-XX-01-F)
-08: EIGHT (USE YFSP-XX-01-E)
-10: TEN (USE YFSP-XX-01-T)
-06: SIX (USE YFSP-XX-01-6)
(AVAILABLE IN 20 POS. ONLY)
-03: THREE (USE YFSP-XX-01-3)
(AVAILABLE IN 20 POS. ONLY)
PLATING SPECIFICATION
-G: GOLD (USE C-XXX-03-G)
(SEE NOTE 7)
-H: HEAVY GOLD (USE C-XXX-03-H)
-E: EXTRA GOLD (USE C-XXX-03-E)
(SEE NOTE 7)
OPTION
-K: KAPTON PAD
(SEE FIG. 2, SHT. 2)
-TR: TAPE & REEL
LEAD STYLE
-03: PIN / SOLDERBALLS
(USE C-140-03-X, SEE FIG. 1)
-L3: PIN / SOLDERBALLS
(LOW INSERTION FORCE)
(USE C-226-03-X)
SOLDER BALLS
-SB: SOLDER BALL
(USE SDB-030-6337)
-MSB: MODIFIED SOLDER BALL
(USE SDB-030-9653, Pb
FREE,SEE NOTE 14)
* = NOT ENGINEERING APPROVED
*
H
.145 3.68
REF
(No OF POS x .0500[1.270]) + .120[3.05] REF
"B"
REF
(No OF POS x .0500[1.270]) + .020[.51] REF
"A" EQ SPACES
@ .0500[1.270]
((No OF POS -1) x .0500[1.270]))
.0020[.051]
.035
REF
0.89
"A"
"B"
C1
01
YFSP-XX-01-X
02
09 (PIN # = NO. OF ROWS +1)
.095 2.41
REF
.104 2.64
REF
.012 0.31
(SEE NOTE 9)
.134±.003 3.41±0.08
SECTION "A"-"A"
C-XXX-03-X
SDB-030-XXXX
'A'
SECTION "B"-"B"
SEE NOTE 6
DETAIL 'A'
SCALE 5 : 1
IN-PROCESS WITHOUT SOLDERBALLS
C
H
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
.XX: .01[.3]
2
.XXX: .005[.13]
.XXXX: .0020[.051]
MATERIAL:
.050[1.27] MULTI-ROW SOCKET ASM.
BY:
YFS-XX-X3-X-XX-XSB-XX
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
KEVIN B
4/22/99
2
1
SHEET SCALE: 2.5:1
INSULATOR: LCP, COLOR: BLACK
CONTACT: PHOS BRONZE
F:\dwg\misc\mktg\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW
NOTES:
1.
REPRESENTS A CRITICAL DIMENSION.
2. NOTE DELETED.
3. BURR ALLOWANCE: .0005[0.013] MAX.
4. MINIMUM PUSHOUT FORCE: .5 LB.
5. NOTE DELETED.
6. CONTACT TO BE FLUSH .002[0.05] RECESSED.
7. ONE REEL MINIMUM PLATING REQUIREMENT
(85,000 CONTACTS PER REEL)
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE
CENTERLINE WITHIN .001[0.03].
9. .0025[0.064] MAX VARIATION BETWEEN
SOLDERBALLS.
10. REFER TO VISUAL INSPECTION BOARD FOR
SOLDERBALL APPEARANCE CHECKS.
11. THE DISTANCE FROM THE CENTER OF ANY
SOLDERBALL TO THE CENTER OF ANY
ADJACENT INNER PEG SHALL BE
.025 .005[0.64 0.13].
12. SOLDER JOINTS TO BE INSPECTED PER IPC
SPECIFICATION 12.2.12 (IPC-A-610C).
13. NOTE DELETED
14. CONTACT SAMTEC CES DEPARTMENT FOR
PROCESSING INFORMATION.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
REVISION H
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PDF描述 |
|---|---|
| YFS-30-L3-E-03-MSB-TR | BGA90, IC SOCKET |
| YFS-30-L3-E-03-SB-K | BGA90, IC SOCKET |
| YFS-30-L3-E-05-MSB-TR | BGA150, IC SOCKET |
| YFS-30-L3-E-06-MSB-K | BGA180, IC SOCKET |
| YFS-30-L3-E-08-MSB-K | BGA240, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| YFS-30-03-H-10-SB | 制造商:Samtec Inc 功能描述:Conn Array Socket SKT 300 POS 1.27mm Solder ST SMD Tube 制造商:Samtec Inc 功能描述:CONN ARY SCKT SKT 300 POS 1.27MM SLDR ST SMD - Bulk |
| YFS-30-03-H-10-SB-K | 制造商:Samtec Inc 功能描述:Conn Array Socket SKT 300 POS 1.27mm Solder ST SMD Tube 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 300 POS 1.27MM SLDR ST SMD - Bulk |
| YFS-30-03-H-10-SB-K-TR | 制造商:Samtec Inc 功能描述:Conn Array Socket SKT 300 POS 1.27mm Solder ST SMD T/R |
| YFS-30-03-H-10-SB-TR | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 300 POS 1.27MM SLDR ST SMD - Tape and Reel |
| YFS-30-04-E-08-SB | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 240 POS 1.27MM SLDR ST SMD - Bulk |
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