參數資料
| 型號： | 161000F00000G |
| 廠商： | Aavid Thermalloy |
| 文件頁數： | 20/116頁 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全數據表： | 1600 Hardener 1600 Resin |
| 標準包裝： | 1 |
| 系列： | Ther-O-Bond 1600 |
| 類型： | 樹脂和硬化劑 |
| 尺寸/尺寸： | 10 克容器 |
| 其它名稱： | 000112 |
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116
THE
T
O
T
AL
INTEGR
A
T
ED
SOL
UTION
F
OR
C
OOLING
ELECTRONICS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Thermalloy has the expertise to design and
manufacture cooling solutions spanning the entire
range of thermal efficiency and mechanical complexity.
The board level products displayed in this catalog
represent only a fraction of our capabilities. Most
applications require custom solutions, which is why
so many leading electronics companies partner with
Aavid Thermalloy.
For demanding applications Aavid Thermalloy
can design and validate custom innovative solutions
utilizing the most advanced engineering resources
saving you precious development time. Our manufac-
turing facilities, located in strategic markets around
the globe, deliver cost effective products providing
you a competitive advantage. From concept to
production, Aavid Thermalloy can enable your
design anywhere in the world.
The Total Integrated Solution for Cooling Electronics
There are 4 cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in
having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The
above graph is a starting point to determine which technology can be used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at:
www.aavidthermalloy.com
Experts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Our clients include
Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and
other industry leading companies worldwide. Utilizing
the latest CFD/FEA and experimental techniques we can:
Perform conjugate analyses with conduction,
convection and radiation
Optimize venting and fan placement
Increase power density
Reduce noise, cost and size.
Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
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