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參數資料
型號： 161000F00000G
廠商： Aavid Thermalloy
文件頁數： 35/116頁
文件大小： 0K
描述： THERMAL EPOXY
MSDS 材料安全數據表： 1600 Hardener
1600 Resin
標準包裝： 1
系列： Ther-O-Bond 1600
類型： 樹脂和硬化劑
尺寸/尺寸： 10 克容器
其它名稱： 000112
25
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7109
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
5
0
20
40
60
80
100
01
2
3
4
5
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400)
7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734
Surface mount heat sink for D
3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
B
C
D
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相關代理商/技術參數
參數描述
1610010000 制造商:Weidmuller 功能描述:CONN ACC CONN MARKER POLYAMIDE/POLYOXYMETHYLENE WHITE - Labels that come on sheets or rolls
1610-0-15-00-00-00-04-0 功能描述:電路板硬件 - PCB PRESS FIT PIN RECPT RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
1610-0-15-01-30-02-04-0 功能描述:電路板硬件 - PCB 200u SN/PB OVER NI 30 CON RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
1610-0-15-01-30-14-04-0 制造商:Mill-Max Mfg Corp 功能描述:Contact SKT Press Fit ST Thru-Hole Bulk
1610-0-15-01-30-27-04-0 功能描述:電路板硬件 - PCB 200u SN/PB OVER NI 30 CON RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
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