
2N7334
IRFG110
VGS
Gate – Source Voltage
ID
Continuous Drain Current
(VGS = 10V , Tcase = 25°C)
ID
Continuous Drain Current
(VGS = 10V , Tcase = 100°C)
IDM
Pulsed Drain Current
PD
Power Dissipation @ Tcase = 25°C
Linear Derating Factor
EAS
Single Pulse Avalanche Energy 2
dv/dt
Peak Diode Recovery 3
TJ , Tstg
Operating and Storage Temperature Range
RθJC
Thermal Resistance Junction to Case
RθJCA
Thermal Resistance Junction-to-Ambient
±20V
1.A
0.6A
4A
1.4W
0.011W/°C
75mJ
5.5V/ns
–55 to 150°C
6.25°C/W
175°C/W
MECHANICAL DATA
Dimensions in mm (inches)
14
1
8
7
2.134
(0.084)
6.
42
6
±
0.3
0
5
(0
.2
53
±
0
.0
12)
9.
52
5
±
0.6
3
5
(0
.3
75
±
0
.0
25)
1.422 ± 0.102
(0.056 ± 0.004)
2.54
(0.100)
0.457 ± 0.102
(0.018 ± 0.004)
19.507 ± 0.432
(0.768 ± 0.017)
ABSOLUTE MAXIMUM RATINGS(T
case = 25°C unless otherwise stated)
14 LEAD MOULDED DIP PACKAGE
Notes
1) Pulse Test: Pulse Width
≤ 300s, δ≤ 2%
2) @ VDD = 25V , L ≥ 112mH , RG = 25 , Peak IL = 1A , Starting TJ = 25°C
3) @ ISD ≤ 1A , di/dt ≤ 75A/s , VDD ≤ BVDSS , TJ ≤ 150°C , Suggested RG = 24
14 LEAD DUAL IN LINE QUAD
N-CHANNEL
POWER MOSFETS
FEATURES
AVALANCHE ENERGY RATED
HERMETICALLY SEALED
DYNAMIC dv/dt RATING
SIMPLE DRIVE REQUIREMENTS
FOR AUTOMATIC INSERTION
SIMPLE DRIVE REQUIREMENTS
EASE OF PARALLELING
4 N-CHANNEL CO-PACKAGED HEXFETS
LIGHTWEIGHT
N-CHANNEL
1—Drain 1
2—Source 1
3—Gate 1
N-CHANNEL
5—Gate 2
6—Source 2
7—Drain 2
N-CHANNEL
8—Drain 3
9—Source3
10—Gate 3
N-CHANNEL
12—Gate 4
13—Source 4
14—Drain 4
BVDSS
±100V
ID(cont)
1A
RDS(on)
0.7
11,4—NC
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab encourages customers to verify that datasheets are current before placing orders.
Document Number 5829
Issue 1