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參數資料
型號: 505103B00000G
廠商: Aavid Thermalloy
文件頁數: 20/116頁
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
產品培訓模塊: How to Select a Heat Sink
標準包裝: 250
類型: 插件板級
冷卻式包裝: TO-3
固定方法: 把緊螺栓
形狀: 方形
長度: 1.780"(45.21mm)
寬: 1.780"(45.21mm)
機座外的高度(散熱片高度): 0.500"(12.70mm)
溫升時的功耗: 4W @ 40°C
在強制氣流下的熱敏電阻: 在 200 LFM 時為4.5°C/W
自然環境下的熱電阻: 10°C/W
材質:
材料表面處理: 黑色陽極化處理
其它名稱: 001259
116
THE
T
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AL
INTEGR
A
T
ED
SOL
UTION
F
OR
C
OOLING
ELECTRONICS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Thermalloy has the expertise to design and
manufacture cooling solutions spanning the entire
range of thermal efficiency and mechanical complexity.
The board level products displayed in this catalog
represent only a fraction of our capabilities. Most
applications require custom solutions, which is why
so many leading electronics companies partner with
Aavid Thermalloy.
For demanding applications Aavid Thermalloy
can design and validate custom innovative solutions
utilizing the most advanced engineering resources
saving you precious development time. Our manufac-
turing facilities, located in strategic markets around
the globe, deliver cost effective products providing
you a competitive advantage. From concept to
production, Aavid Thermalloy can enable your
design anywhere in the world.
The Total Integrated Solution for Cooling Electronics
There are 4 cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in
having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The
above graph is a starting point to determine which technology can be used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at:
www.aavidthermalloy.com
Experts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Our clients include
Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and
other industry leading companies worldwide. Utilizing
the latest CFD/FEA and experimental techniques we can:
Perform conjugate analyses with conduction,
convection and radiation
Optimize venting and fan placement
Increase power density
Reduce noise, cost and size.
Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
相關PDF資料
PDF描述
1590XXGR BOX ALUM 5.72X4.77X1.55" GREEN
AXK830245WG CONN HEADER FPC .4MM 30POS SMD
530802B05150G BOARD LEVEL HEAT SINK
AXK830135WG CONN HEADER FPC .4MM 30POS SMD
1590XXCB BOX ALUM 5.72X4.77X1.55" BLUE
相關代理商/技術參數
參數描述
5051-04 制造商:Molex 功能描述:2.5mm 4 1 Housing Zv^N 10.5mm 250V 3/ContactA 105 -40 12.7mm 6.6mm
505105 制造商:EMBER INDUSTRIES 功能描述:CONDUCTOR PREFAB, WINDRIVE 7X1 CABLE: U
5051-05 制造商:Molex 功能描述:2.5mm 5 1 Housing Zv^N 13mm 250V 3/ContactA 105 -40 12.7mm 6.6mm
505105-000 制造商:TE Connectivity 功能描述:Multiconductor Cable 制造商:TE Connectivity 功能描述:EPD52215A - Cable Rools/Shrink Tubing
505106 制造商:EMBER INDUSTRIES 功能描述:CONDUCTOR PREFAB, WINDRIVE 6X1
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