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參數資料
| 型號： | 5962-9081201MGA |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 緩沖放大器 |
| 英文描述： | BUFFER AMPLIFIER, MBCY8 |
| 封裝： | METAL CAN-8 |
| 文件頁數： | 11/13頁 |
| 文件大小： | 339K |
| 代理商： | 5962-9081201MGA |
Application Hints (Continued)
The heatsink for the LM6321 is made using the PC board
copper. The heat is conducted from the die, through the lead
frame (inside the part), and out the pins which are soldered
to the PC board. The pins used for heat conduction are:
TABLE 1.
Part
Package
Pins
LM6321N
8-Pin DIP
1, 4, 5, 8
LM6321M
14-Pin SO
1, 2, 3, 6, 7,
8, 9, 13, 14
Figure 3 shows copper patterns which may be used to dissi-
pate heat from the LM6321.
TABLE 2.
Package
L (in.)
H (in.)
θ
J–A (C/W)
8-Pin DIP
2
0.5
47
14-Pin SO
1
0.5
69
21
57
Table 2 shows some values of junction-to-ambient thermal
resistance (
θ
J–A) for values of L and W for 2 oz. copper:
8-Pin DIP
DS009223-9
14-Pin SO
DS009223-10
*For best results, use L = 2H
FIGURE 3. Copper Heatsink Patterns
www.national.com
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