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參數(shù)資料
| 型號： | 5962-9081201MGA |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 緩沖放大器 |
| 英文描述： | BUFFER AMPLIFIER, MBCY8 |
| 封裝： | METAL CAN-8 |
| 文件頁數(shù)： | 8/13頁 |
| 文件大小： | 339K |
| 代理商： | 5962-9081201MGA |
AC Electrical Characteristics
The following specifications apply for Supply Voltage = ±15V, V
CM = 0, RL ≥ 100 k and RS = 50 unless otherwise noted.
Boldface limits apply for T
A = TJ = TMIN to TMAX; all other limits TA = TJ = 25C.
Symbol
Parameter
Conditions
Typ
LM6121
LM6221
LM6321
Units
Limit
(Note 5)
SR
1
Slew Rate 1
V
IN = ±11V, RL = 1k
1200
550
V/s
Min
SR
2
Slew Rate 2
V
IN = ±11V, RL = 50
800
550
(Note 7)
SR
3
Slew Rate 3
V
IN = 2VPP,RL = 50
50
550
V
+ = 5V (Note 6)
BW
3 dB Bandwidth
V
IN = ±100 mVPP,RL = 50
50
30
MHz
C
L ≤ 10 pF
Min
t
r,tf
Rise Time
R
L = 50,CL ≤ 10 pF
7.0
ns
Fall Time
V
O = 100 mVPP
t
pd
Propagation
R
L = 50,CL ≤ 10 pF
4.0
ns
Delay Time
V
O = 100 mVPP
O
S
Overshoot
R
L = 50,CL ≤ 10 pF
10
%
V
O = 100 mVPP
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions.
Note 2: During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to output differential voltages
in excess of 8V the input current should be limited to ±20 mA.
Note 3: The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions.
Note 4: The thermal resistance
θJA of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1,
4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistance
θJA of the N package is 84C/W. The thermal re-
sistance
θJA of the device in the M package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14) are
connected to 1 square inch of 2 oz. copper.
Note 5: Limits are guaranteed by testing or correlation.
Note 6: The input is biased to 2.5V and VIN swings Vpp about this value. The input swing is 2 Vpp at all temperatures except for the AV 3 test at 55C where it is
reduced to 1.5 Vpp.
Note 7: Slew rate is measured with a ±11V input pulse and 50
source impedance at 25C. Since voltage gain is typically 0.9 driving a 50 load, the output swing
will be approximately ±10V. Slew rate is calculated for transitions between ±5V levels on both rising and falling edges. A high speed measurement is done to minimize
device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to ±10V for measurements
at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/s.
Note 8: The test circuit consists of the human body model of 120 pF in series with 1500
.
Note 9: For specification limits over the full Military Temperature Range, see RETS6121X.
Note 10: The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =
(TJ(max)–TA)/θJA.
Typical Performance Characteristics T
J = 25C, unless otherwise specified
Frequency Response
DS009223-11
Frequency Response
DS009223-12
Slew Rate vs Temperature
DS009223-13
www.national.com
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