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參數資料
| 型號： | 5962F9676701VXC |
| 廠商： | INTERSIL CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, CDFP8 |
| 封裝： | ROHS COMPLIANT, GLASS, FP-8 |
| 文件頁數： | 6/9頁 |
| 文件大小： | 252K |
| 代理商： | 5962F9676701VXC |
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All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4099.3
April 6, 2009
Die Characteristics
DIE DIMENSIONS:
59 mils x 58.2 mils x 19 mils
±1 mil
1500m x 1480m x 483m
±25.4m
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 4k
±0.5k
Top Metallization:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16k
±0.8k
Substrate:
UHF-1, Bonded Wafer, DI
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Floating
ADDITIONAL INFORMATION:
Worst Case Current Density:
< 2 x 105A/cm2
Transistor Count:
89
Metallization Mask Layout
HS-1135RH
V-
OUT
+IN
-IN
V+
VL
VH
HS-1135RH
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