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參數資料
| 型號： | 6N136-60 |
| 元件分類： | 光電耦合器 |
| 英文描述： | 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER |
| 封裝： | 0.300 INCH, DIP-8 |
| 文件頁數： | 11/14頁 |
| 文件大小： | 147K |
| 代理商： | 6N136-60 |
6
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
Solder Reow Thermal Prole
Recommended Pb-Free IR Prole
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)
0
TIME (SECONDS)
TEMPERA
TURE
(
C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160 C
140 C
150 C
PEAK
TEMP.
245 C
PEAK
TEMP.
240 C
PEAK
TEMP.
230 C
SOLDERING
TIME
200 C
PREHEATING TIME
150 C, 90 + 30 SEC.
2.5 C ± 0.5 C/SEC.
3 C + 1 C/–0.5 C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 C + 1 C/–0.5 C/SEC.
REFLOW HEATING RATE 2.5 C ± 0.5 C/SEC.
NOTE: NON-HALIDE FLUX SHOULD BE USED.
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
* 260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERA
TURE
NOTES:
THE TIME FROM 25 C to PEAK
TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 C, Tsmin = 150 C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 C
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| 6N135-320 | 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 1 Mbps |
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