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參數(shù)資料
型號(hào): 74LV4316D-T
廠商: NXP SEMICONDUCTORS
元件分類: 多路復(fù)用及模擬開關(guān)
英文描述: QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16
文件頁(yè)數(shù): 11/16頁(yè)
文件大小: 156K
代理商: 74LV4316D-T
Philips Semiconductors
Product specification
74LV4316
Quad bilateral switches
1998 Jun 23
4
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VCC
DC supply voltage
See Note 1
1.0
3.3
6.0
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
Tamb
Operating ambient temperature range in free air
See DC and AC
characteristics
–40
+85
+125
°C
tr, tf
Input rise and fall times
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
VCC = 3.6V to 5.5V
500
200
100
50
ns/V
NOTE:
1. The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 5.5V.
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
RATING
UNIT
VCC
DC supply voltage
–0.5 to +7.0
V
"IIK
DC input diode current
VI < –0.5 or VI > VCC + 0.5V
20
mA
"IOK
DC output diode current
VO < –0.5 or VO > VCC + 0.5V
20
mA
"IO
DC switch current
–0.5V < VO < VCC + 0.5V
25
mA
Tstg
Storage temperature range
–65 to +150
°C
PTOT
Power dissipation per package
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
for temperature range: –40 to +125
°C
above +70
°C derate linearly with 12 mW/K
above +70
°C derate linearly with 8 mW/K
above +60
°C derate linearly with 5.5 mW/K
750
500
400
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
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