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參數資料
| 型號： | 75433-EP |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | POWER GOOD FAST-TRANSIENT-RESPONSE 2-A LOW-DROPOUT VOLTAGE REGULATORS |
| 中文描述： | 電源良好快速瞬態響應2 -低壓差電壓調節器 |
| 文件頁數： | 22/27頁 |
| 文件大?。?/td> | 388K |
| 代理商： | 75433-EP |
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TPS75201-EP TPS75215-EP TPS75218-EP TPS75225-EP TPS75233-EP WITH RESET
TPS75401-EP
’
75415-EP
’
75418-EP
’
75425-EP
’
75433-EP WITH POWER GOOD
FAST-TRANSIENT-RESPONSE 2-A LOW-DROPOUT VOLTAGE REGULATORS
SGLS165
–
APRIL 2003
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP
–
PowerPad
) (continued)
The thermal pad is directly connected to the substrate of the IC, which for the TPS752xxQPWPEP and
TPS754xxQPWPEP series is a secondary electrical connection to device ground. The heat-sink surface that is
added to the PWP can be a ground plane or left electrically isolated. In TO220-type surface-mount packages, the
thermal connection is also the primary electrical connection for a given terminal which is not always ground. The
PWP package provides up to 16 independent leads that can be used as inputs and outputs (Note: leads 1, 10, 11,
and 20 are internally connected to the thermal pad and the IC substrate).
100
75
50
25
0
2
3
5
–
–
J
θ
125
THERMAL RESISTANCE
vs
COPPER HEAT-SINK AREA
150
7
8
1
4
6
0.3
Natural Convection
50 ft/min
250 ft/min
300 ft/min
C
°
Copper Heat-Sink Area
–
cm2
100 ft/min
150 ft/min
200 ft/min
R
Figure 26
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|---|---|
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| 755332-1 | Dual Low Offset, Low Power Operational Amplifier; Package: CerDIP; No of Pins: 8; Temperature Range: Military |
| 75543-010 | OSC 3.3V 8PIN TTL/CMOS |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 75434-0006 | 制造商:MOLEX 功能描述:GBX BACKPLANE 3 PAIR 25 C |
| 75434-0007 | 制造商:MOLEX 功能描述:GBX BACKPLANE 3 PAIR 25 C |
| 75434-0022 | 制造商:MOLEX 功能描述:GBX BACKPLANE 3 PAIR 25 C |
| 75434-0023 | 制造商:MOLEX 功能描述:GBX 3 PAIR 10 COLUMN OPEN BACKPLANE ASSY |
| 75434-0024 | 制造商:MOLEX 功能描述:GBX 3 PAIR BPLANE CUSTUM 25 COL OPEN END |
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