- 您現在的位置：買賣IC網 > PDF目錄36336 > 935261221118 (NXP SEMICONDUCTORS) SPECIALTY CONSUMER CIRCUIT, PDSO28 PDF資料下載
參數資料
| 型號： | 935261221118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 封裝： | PLASTIC, SOT-341, SSOP-28 |
| 文件頁數： | 30/44頁 |
| 文件大?。?/td> | 241K |
| 代理商： | 935261221118 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁當前第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁
2000 Jan 24
36
Philips Semiconductors
Product specication
5 V mixers/oscillators and synthesizers for
cable TV and VCR 2-band tuners
TDA6402; TDA6402A;
TDA6403; TDA6403A
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| 935261221512 | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 935261221518 | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 935261234112 | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 935261234118 | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 935261234512 | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 935262025112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935262217118 | 制造商:NXP Semiconductors 功能描述:Real Time Clock Serial 8-Pin SO T/R |
| 935264217557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935267356112 | 制造商:NXP Semiconductors 功能描述:IC TEA1507PN |
| 935268081112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
發布緊急采購，3分鐘左右您將得到回復。