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參數資料
| 型號： | 935261315112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO20 |
| 封裝： | PLASTIC, SOT-163, SO-20 |
| 文件頁數： | 12/31頁 |
| 文件大小： | 292K |
| 代理商： | 935261315112 |
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1998 Jun 02
2
Philips Semiconductors
Preliminary specication
2
× 1.4 W BTL audio ampliers with digital
volume control and headphone sensing
TDA8552T; TDA8552TS
FEATURES
One pin digital volume control (for each channel)
Volume setting with up/down pulses
Auto repeat function on volume setting
Headphone sensing
Maximum gain set by selection pin
Low sensitivity for EMC radiation
Internal feedback resistors
Flexibility in use
Few external components
Low saturation voltage of output stage
Standby mode controlled by CMOS compatible levels
Low standby current
No switch-on/switch-off plops
High supply voltage ripple rejection
Protected against electrostatic discharge
Outputs short-circuit safe to ground, VDD and across the
load
Thermally protected.
APPLICATIONS
Portable consumer products
Notebook computers
Communication equipment.
GENERAL DESCRIPTION
The TDA8552T is a two channel audio power amplifier that
provides an output power of 2
× 1.4 W into an 8 load
using a 5 V power supply. The circuit contains two BTL
power amplifiers, two digital volume controls and
standby/mute logic. Volume and balance of the amplifiers
are controlled using two digital input pins which can be
driven by simple push-buttons or by a microcontroller.
Using the selection pin (GAINSEL) the maximum gain can
be set at 20 or 30 dB. The headphone sense input (HPS)
can be used to detect if a headphone is plugged into the
jack connector. If a headphone is plugged into the jack
connector the amplifier switches from the BTL to the SE
mode and the BTL loudspeakers are switched off. This
also results in a reduction of quiescent current
consumption.
The TDA8552T is contained in a 20-pin small outline
package. For the TDA8552TS, which is contained in a
20-pin very small outline package, the maximum output
power is limited by the maximum allowed ambient
temperature. More information can be found in Section
“Thermal design considerations”. The SO20 package has
the four corner leads connected to the die pad so that the
thermal behaviour can be improved by the PCB layout.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8552T
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
TDA8552TS
SSOP20
plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
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