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參數資料
| 型號： | 935261315112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO20 |
| 封裝： | PLASTIC, SOT-163, SO-20 |
| 文件頁數： | 27/31頁 |
| 文件大小： | 292K |
| 代理商： | 935261315112 |
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1998 Jun 02
5
Philips Semiconductors
Preliminary specication
2
× 1.4 W BTL audio ampliers with digital
volume control and headphone sensing
TDA8552T; TDA8552TS
PINNING
Note
1. For the SO20 (SOT163-1) package only: the ground
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
SYMBOL
PIN(1)
DESCRIPTION
GND1
1
ground 1, substrate/leadframe
OUT2+
2
positive loudspeaker terminal
output channel 2
VDD1
3
supply voltage 1
HPS
4
digital input for headphone
sensing
MODE
5
digital trinary input for mode
selection (standby, mute and
operating)
UP/DOWN1
6
digital trinary input for volume
control channel 1
UP/DOWN2
7
digital trinary input for volume
control channel 2
VDD2
8
supply voltage 2
OUT2
9
negative loudspeaker terminal
output channel 2
GND2
10
ground 2, substrate/leadframe
GND3
11
ground 3, substrate/leadframe
OUT1+
12
positive loudspeaker terminal
output channel 1
VDD3
13
supply voltage 3
GAINSEL
14
digital input for gain selection
IN2
15
audio input channel 2
SVR
16
half supply voltage, decoupling
ripple rejection
IN1
17
audio input channel 1
VDD4
18
supply voltage 4
OUT1
19
negative loudspeaker terminal
output channel 1
GND4
20
ground 4, substrate/leadframe
Fig.2 Pin configuration.
handbook, halfpage
GND1
OUT2
+
VDD1
HPS
MODE
UP/DOWN1
UP/DOWN2
VDD2
OUT2
GND2
GND4
OUT1
VDD4
IN1
IN2
GAINSEL
SVR
VDD3
OUT1
+
GND3
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA8552T
MGM610
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