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參數(shù)資料
型號(hào)： 935264466005
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, UUC
封裝： WAFER
文件頁(yè)數(shù)： 12/23頁(yè)
文件大小： 337K
代理商： 935264466005
ICODE1 Chip Specification
Rev. 2.2
January 2005
SL040522.doc/B
Public
Page 2 of 23
1 Contents
1
CONTENTS
2
DEFINITIONS
4
2.1
Life Support Applications .................................................................................................... 4
2.2
Abbreviations ........................................................................................................................ 4
3
SCOPE
5
4
ORDERING INFORMATION
5
FUNCTIONAL DESCRIPTION
6
5.1
Basic Features ....................................................................................................................... 6
5.2
Block Diagram of the IC....................................................................................................... 6
5.3
Memory Organisation........................................................................................................... 7
5.3.1
Serial Number .................................................................................................................. 7
5.3.2
Write Access Conditions .................................................................................................. 7
5.3.3
Special Functions (EAS/QUIET)..................................................................................... 8
5.3.4
Family Code and Application Identifier........................................................................... 8
5.3.5
Configuration of delivered ICs......................................................................................... 9
6
MECHANICAL DIE SPECIFICATIONS
10
7
MECHANICAL WAFER SPECIFICATIONS
11
7.1
Wafer Status ........................................................................................................................ 11
7.2
Backside Treatment ............................................................................................................ 11
8
DOCUMENTATION
12
8.1
Delivery Documentation..................................................................................................... 12
8.2
Fail-Die Identification......................................................................................................... 12
8.2.1
Ink Dot Specification..................................................................................................... 12
8.2.2
Wafer Mapping............................................................................................................... 12
9
QUALITY ASSURANCE
13
9.1
Electrical Acceptance Test................................................................................................. 13
9.2
Visual Inspection................................................................................................................. 13
9.2.1
After Wafer Final Test ................................................................................................... 13
9.2.2
After Sawing (Film Frame Carrier)................................................................................ 13
10
PACKING
14
10.1
Storage Recommendations ............................................................................................. 14
10.2
Delivery form ................................................................................................................... 14
11
HANDLING RECOMMENDATIONS
15
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