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參數(shù)資料
型號: 935264466005
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, UUC
封裝: WAFER
文件頁數(shù): 6/23頁
文件大小: 337K
代理商: 935264466005
ICODE1 Chip Specification
Rev. 2.2
January 2005
SL040522.doc/B
Public
Page 14 of 23
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of sawn wafers is done according to Philips ‘General
Specification for 6” Wafer (Prod. Spec.)’.
10.1 Storage Recommendations
Sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
15 ... 25 °C
Climate atmosphere:
40 ... 60 % r.h. or dried N2 (only unsawn wafers!)
Duration of storage:
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Delivery form
Delivery form:
Film Frame Carrier (standard Philips carrier type P7)
Foil thickness:
0.55 ... 0.85 mm
Foil material:
sticky foil
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