參數資料
| 型號： | 9882 1 IN X 36 YD |
| 廠商： | 3M |
| 文件頁數： | 4/5頁 |
| 文件大小： | 0K |
| 描述： | THERM COND ADH 2.0MIL 1"X36YD |
| 特色產品： | Thermal Interface Materials |
| 標準包裝： | 9 |
| 類型： | 丙烯酸粘合劑 |
| 尺寸/尺寸： | 1.00" W x 36 yd 卷 |
| 其它名稱： | 3M9590 70006178910 |
3M Thermally Conductive Pads
5516 / 5516S
0.5, 1.0, 1.5, 2.0
3.1
5519/5519S
0.5, 1.0, 1.5, 2.0
4.9
5591S
0.5, 1.0, 1.5, 2.0
1.0
5592/5592S
0.5, 1.0, 1.5, 2.0
1.1
5595/5595S
0.5, 1.0, 1.5, 2.0
1.6
3M
Thermally Conductive Adhesive Transfer Tapes
9882
9885 9890
Application Guidelines (continued)
6.) Rework Tips:
Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying,
torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-
cleaned according to the recommendations in this data page.
Heating up the substrates can reduce the adhesion level and make removal easier.
Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make
prying, torquing or peeling apart the substrates easier.
General Information
Product selection table for 3M Thermally Conductive Materials.
Bulk Thermal
Thickness
Conductivity
Product
(mm)
(W/m-K)
Typical Applications
3M Thermally Conductive Tapes
8805
0.127
8810
0.25
0.6
8815
0.375
8820
0.50
9889FR
1.0
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
plasma display, IC packages and PCB bonding to heat sinks, metal cases
and other cooling devices.
Applications requiring gap filling and superior thermal performance
without bonding. IC package and PCB thermal interfacing with heat sinks
or other cooling devices and metal cases.
Application Ideas
3M Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential heat-
transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
Only the “S” versions are available in 0.5 mm thicknesses.
“S” designation signifies a polyester film on one side to provide a non-tacky surface.
“H” designation signifies a product with one one-tacky surface without the use of PET film.
(4)
3M Thermally Conductive Epoxy Adhesives
TC-2707
—
0.7
TC-2810
—
1.0
DP-190 Gray
—
0.4
Applications requiring high adhesive strength, good surface wet-out, gap
filling and good thermal transfer. Provides IC package and PCB thermal
interfacing with heat sinks or other cooling devices.
3M Thermally Conductive Pads (Acrylic)
5589H
1.0, 1.5
2.0
5590H
0.5, 1.0, 1.5
3.0
These pads use an acrylic elastomer for applications that require a non-
silicone thermal pad. Provides IC package and PCB thermal interfacing
with heat sinks or other cooling devices, and metal cases.
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