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參數資料
| 型號： | AD8063-EB |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
| 中文描述： | 低成本，300MHz的軌到軌放大器 |
| 文件頁數： | 5/16頁 |
| 文件大小： | 314K |
| 代理商： | AD8063-EB |
AD8061/AD8062/AD8063
–5–
REV. C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8061/AD8062/AD8063 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Internal Power Dissipation
2
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.8 W
SOT-23-5 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
SOT-23-6 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
μ
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W
Input Voltage (Common-Mode) (–V
S
– 0.2 V) to (+V
S
– 1.8 V)
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
±
V
S
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range R, RM, SOT-23-5,
SOT-23-6 . . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +125
°
C
Operating Temperature Range . . . . . . . . . . . –40
°
C to +85
°
C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead SOIC Package:
θ
= 160
°
C/W;
θ
= 56
°
C/W
5-Lead SOT-23-5 Package:
θ
JA
= 240
°
C/W;
θ
JC
= 92
°
C/W
6-Lead SOT-23-6 Package:
θ
= 230
°
C/W;
θ
= 92
°
C/W
8-Lead
μ
SOIC Package:
θ
JA
= 200
°
C/W;
θ
JC
= 44
°
C/W.
ORDERING GUIDE
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package
Description
Package
Option
Branding
Information
Model
AD8061AR
AD8061AR-REEL
AD8061AR-REEL7
AD8061ART-REEL
AD8061ART-REEL7
AD8062AR
AD8062AR-REEL
AD8062AR-REEL7
AD8062ARM
AD8062ARM-REEL
AD8062ARM-REEL7
AD8063AR
AD8063AR-REEL
AD8063AR-REEL7
AD8063ART-REEL
AD8063ART-REEL7
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
5-Lead SOT-23
5-Lead SOT-23
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead
μ
SOIC
8-Lead
μ
SOIC
8-Lead
μ
SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
6-Lead SOT-23
6-Lead SOT-23
SO-8
13-Inch Tape and Reel
7-Inch Tape and Reel
RT-5, 13-Inch Tape and Reel
RT-5, 7-Inch Tape and Reel
SO-8
13-Inch Tape and Reel
7-Inch Tape and Reel
RM-8
13-Inch Tape and Reel
7-Inch Tape and Reel
SO-8
13-Inch Tape and Reel
7-Inch Tape and Reel
RT-6, 13-Inch Tape and Reel
RT-6, 7-Inch Tape and Reel
HGA
HGA
HCA
HCA
HCA
HHA
HHA
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD806x
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150
°
C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175
°
C for an extended period can result
in device failure. While the AD806x is internally short circuit
protected, this may not be sufficient to guarantee that the
maximum junction temperature (150
°
C) is not exceeded under
all conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
AMBIENT TEMPERATURE
–
C
2.0
1.0
0
–
50
–
40
M
–
–
30
70
80
90
1.5
0.5
60
50
40
30
0
–
10
–
20
20
10
T
J
= 150 C
SOIC
SOT-23-5, -6
8-LEAD SOIC
PACKAGE
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature for AD8061/AD8062/AD8063
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