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參數資料
| 型號： | AD8392ACP-R2 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | Low Power, High Output Current, Quad Op Amp, Dual-Channel ADSL/ADSL2+ Line Driver |
| 中文描述： | QUAD OP-AMP, 5000 uV OFFSET-MAX, QCC32 |
| 封裝： | 5 X 5 MM, MO-220VHHD, LFCSP-32 |
| 文件頁數： | 5/16頁 |
| 文件大小： | 529K |
| 代理商： | AD8392ACP-R2 |
AD8392
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature
Operating Temperature Range
Lead Temperature Range (Soldering 10 sec)
Junction Temperature
Rev. 0 | Page 5 of 16
Rating
±13 V (+26 V)
See Figure 3
65°C to +150°C
40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, i.e., θ
JA
is specified
for device soldered in circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
LFCSP-32 (CP)
TSSOP-28/EP (RE)
θ
JA
27.27
35.33
Unit
°C/W
°C/W
Maximum Power Dissipation
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). Assuming that the load (R
L
) is midsupply,
the total drive power is V
S
/2 × I
OUT
, some of which is
dissipated in the package and some in the load (V
OUT
× I
OUT
).
RMS output voltages should be considered. If R
L
is referenced
to V
S
as in single-supply operation, the total power is V
S
× I
OUT
.
In single supply with R
L
to V
S
, worst case is V
OUT
= V
S
/2.
Airflow increases heat dissipation, effectively reducing θ
JA
. Also,
more metal directly in contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package versus the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board. θ
JA
values are approximations.
0
1
2
3
4
5
6
7
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90
TEMPERATURE (
°
C)
M
T
J
= 150
°
C
0
LFCSP-32
TSSOP-28/EP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
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