
–3–
REV. 0
AD8582
WARNING!
ESD SENSITIVE DEVICE
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8582 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUT E MAX IMUM RAT INGS*
V
DD
to DGND & AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Logic Inputs to DGND . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
V
OUT
to AGND . . . . . . . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
V
REF
to AGND . . . . . . . . . . . . . . . . . . . . .–0.3 V, V
DD
+ 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
I
OUT
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . . .(T
J
max–T
A
)/
θ
JA
T hermal Resistance,
θ
JA
24-Pin Plastic DIP Package (N-24) . . . . . . . . . . . . . 62
°
C/W
24-Lead SOIC Package (SOL-24) . . . . . . . . . . . . . . 73
°
C/W
Maximum Junction T emperature (T
J
max) . . . . . . . . . . 150
°
C
Operating T emperature Range . . . . . . . . . . . . .–40
°
C to +85
°
C
Storage T emperature Range . . . . . . . . . . . . .–65
°
C to +150
°
C
Lead T emperature (Soldering, 10 sec) . . . . . . . . . . . . . +300
°
C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. T his is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PIN DE SCRIPT ION
Pin No.
Name
Description
1, 24
V
OUT A
V
OUT B
Voltage outputs from the DACs. Fixed
output voltage range of 0 V to 4.095 V
with 1 mV/LSB. An internal
temperature stabilized reference
maintains a fixed full-scale voltage
independent of time, temperature and
power supply variations.
Analog Ground. Ground reference for
the internal bandgap reference voltage,
the DAC, and the output buffer.
Digital ground for input logic.
Load DAC register strobes. T ransfers
input register data to the DAC registers.
Active low inputs, Level sensitive latch.
May be connected together to double-
buffer load DAC registers.
Digital Input: High presets DAC
registers to half scale (800
H
), Low
clears DAC registers to zero (000
H
)
upon
RST
assertion.
Active low digital input that clears the
DAC register to zero, setting the DAC
to minimum scale when MSB pin = 0,
or half-scale when MSB pin = 1.
T welve Binary Data Bit Inputs. DB11 is
the MSB and DB0 is the LSB.
Chip Select. Active low input.
Select DAC A = 0 or DAC B = 1.
Positive Supply. Nominal value +5 V,
±
5%.
Nominal 2.5 V reference output
voltage. T his node must be buffered if
required to drive external loads.
2
AGND
3
4, 21
DGND
LDA,
LDB
5
MSB
6
RST
7–18
DB
0–11
19
20
22
23
CS
A
/B
V
DD
V
REF
PIN CONFIGURAT IONS
N-24
24-Pin Plastic DIP
SOL-24
24-Pin SOIC
V
OUTA
AGND
V
OUTB
V
REF
MSB
DB0
DB11
DGND
V
DD
DB1
DB10
DB2
DB9
DB3
DB8
DB4
DB7
DB5
DB6
14
1
2
24
23
5
6
7
20
19
18
3
4
22
21
8
17
9
16
10
15
11
TOP VIEW
(Not to Scale)
12
13
AD8582
LDA
RST
LDB
CS
A/B
TOP VIEW
(Not to Scale)
12
13
AD8582
1
24
LDA, LDB
CS
A/B
D0–D11
RST
t
AS
t
AH
t
DS
t
DH
t
LDW
t
RSW
t
LS
t
LH
V
OUT
t
S
t
S
± 1LSB
ERROR BAND
t
CSW
Timing Diagram
ORDE RING INFORMAT ION*
T emperature
Range
Package
Description
Package
Option
Model
AD8582AN
AD8582AR
AD8582Chips
–40
°
C to +85
°
C
–40
°
C to +85
°
C
+25
°
C
24-Pin Plastic DIP N-24
24-Lead SOIC
Die
SOL-24
*For die specifications contact your local Analog Devices sales office. T he
AD8582 contains 1270 transistors.