
AD9444
ABSOLUTE MAXIMUM RATINGS
Table 5.
With
Respect to
ELECTRICAL
AVDD1
AGND
AVDD2
AGND
DRVDD
DGND
AGND
DGND
AVDD1
DRVDD
AVDD2
DRVDD
AVDD2
AVDD1
D0 to D13
DGND
CLK, MODE
AGND
VIN+, VIN
AGND
VREF
AGND
SENSE
AGND
REFT, REFB
AGND
ENVIRONMENTAL
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Rev. 0 | Page 8 of 40
Parameter
Min
0.3
0.3
0.3
0.3
4
4
4
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–65
–40
Max
+4
+6
+4
+0.3
+4
+6
+6
DRVDD + 0.3
AVDD1 + 0.3
AVDD2 + 0.3
AVDD1 + 0.3
AVDD1 + 0.3
AVDD1 + 0.3
+125
+85
300
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
150
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Thermal Resistance
The heat sink of the AD9444 package must be soldered to
ground.
Table 6.
Package Type
θ
JA
100-Lead TQFP/EP
19.8
θ
JB
8.3
θ
JC
2
Unit
°C/W
Typical θ
JA
= 19.8°C/W (heat-sink soldered) for multilayer
board in still air.
Typical θ
JB
= 8.3°C/W (heat-sink soldered) for multilayer board
in still air.
Typical θ
JC
= 2°C/W (junction to exposed heat sink) represents
the thermal resistance through heat-sink path.
Airflow increases heat dissipation effectively reducing θ
JA
. Also,
more metal directly in contact with the package leads, from
metal traces, through holes, ground, and power planes, reduces
the θ
JA
. It is required that the exposed heat sink be soldered to
the ground plane.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.