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參數資料
| 型號： | ADD8707WCPZ-REEL7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | Circular Connector; No. of Contacts:4; Series:LJT00R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:15; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-4 |
| 中文描述： | 12 BUFFER AMPLIFIER, QCC48 |
| 封裝： | LEAD FREE, MO-220-VKKD, LFCSP-48 |
| 文件頁數： | 14/20頁 |
| 文件大小： | 654K |
| 代理商： | ADD8707WCPZ-REEL7 |
ADD8707
OPERATING TEMPERATURE RANGE
The junction temperature is as follows:
T
J
=
T
AMB
+
θ
JA
×
P
DIS
where:
T
AMB
= ambient temperature specified on the data sheet.
θ
JA
= junction-to-ambient thermal resistance, in °C/watt.
P
DIS
= power dissipated in the device, in watts.
Rev. A | Page 14 of 20
For the ADD8707,
P
DIS
can be calculated by
P
DIS
=
V
DD
×
I
DQ
+ Σ(
I
OUT X(+)
× (V
DD
V
OUT X
)) +
Σ(
I
OUT X(-)
×
V
OUTX
) + (V
DD
–
V
REG OUT
) ×
I
LOAD
where:
V
DD
×
I
DQ
= nominal system power requirements.
I
OUT X(+)
× (V
DD
V
OUT X
) = positive-current amplifier load power
dissipation (current comes from V
DD
).
I
OU XT(-)
×
V
OUT X
=
negative-current amplifier load power
dissipation (current goes to GND).
(V
DD
–
V
REG OUT
)
×
I
LOAD
= regulator load power dissipation.
In this example, T
AMB
= 95°C. To calculate P
DIS
, assume the
values in Table 6.
Table 6.
V
OUT
12
V
OUT
11
V
OUT
10
V
OUT
9
V
OUT
8
V
OUT
7
V
OUT
6
V
OUT
5
V
OUT
4
V
OUT
3
V
OUT
2
V
OUT
1
Σ(
I
OUT X(+)
× (V
DD
V
OUT X
)) + Σ(
I
OUT X(-)
×
V
OUT X
)
V
OUT X
(V)
14.400
12.067
10.512
10.051
9.878
8.554
6.134
4.982
4.694
4.205
2.736
0.202
I
OUT X
(mA)
8.3
7.9
4.5
4.2
5.6
3.3
6.9
5.7
3.5
9.6
9.5
7.2
P (W)
0.0133
0.0311
0.0473
0.0422
0.0343
0.0282
0.0423
0.0628
0.0396
0.113
0.126
0.00145
0.582
V
DD
× I
DQ
= 16 V × 15 mA = 0.240 W.
(V
DD
– V
REG OUT
) × I
LOAD
= (16 V – 14.4 V) × 5 mA = 0.008 W.
P
DIS
= 0.240W + 0.582W + 0.008W = 0.830W.
Example 1
Exposed pad soldered down with via θ
JA
= 28.3°C/W:
T
J
= 95°C + (28.3°C/W) × (0.830 W) = 118.5°C
The maximum junction temperature that is guaranteed before
the part breaks down is 150°C. is The maximum process limit
is 125°C. Because
T
J
is < 150°C and < 125°C, this example
demonstrates a condition where the part should perform within
process limits.
Example 2
Exposed pad not soldered down θ
JA
= 47.7°C/W:
T
J
= 95°C + (47.7°C/W) × (0.830 W) = 134.6°C
In this example,
T
J
is < 150°C but > 125°C. Although the part
should not exhibit any damage here, the process limits have
been exceeded. The part may no longer operate as intended.
These examples show that soldering down the exposed pad is
important for proper heat dissipation. Under the same power-
up and loading conditions, the unsoldered part has a higher
temperature than the soldered part. Therefore, it is strongly
advised that the exposed pad be soldered down.
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