- 您現在的位置：買賣IC網 > PDF目錄374019 > ADP3163 (Analog Devices, Inc.) 500-mA, 4.2-V Li-Ion Charger for Current-Limited App. w/Temp Sense in MSOP-8 8-MSOP-PowerPAD -40 to 85 PDF資料下載
參數資料
| 型號： | ADP3163 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 500-mA, 4.2-V Li-Ion Charger for Current-Limited App. w/Temp Sense in MSOP-8 8-MSOP-PowerPAD -40 to 85 |
| 中文描述： | 5位可編程2-/3-Phase同步降壓控制器 |
| 文件頁數： | 13/16頁 |
| 文件大小： | 138K |
| 代理商： | ADP3163 |
REV. 0
ADP3163
–13–
LAY OUT AND COMPONE NT PLACE ME NT GUIDE LINE S
The following guidelines are recommended for optimal perfor-
mance of a switching regulator in a PC system.
General Recommendations
1.
For good results, at least a four-layer PCB is recommended.
This should allow the needed versatility for control circuitry
interconnections with optimal placement, a signal ground
plane, power planes for both power ground and the input
power (e.g., 12 V), and wide interconnection traces in the
rest of the power delivery current paths. Keep in mind that
each square unit of 1 ounce copper trace has a resistance of
~0.53 m
at room temperature.
2.
Whenever high currents must be routed between PCB layers,
vias should be used liberally to create several parallel cur-
rent paths so that the resistance and inductance introduced
by these current paths is minimized and the via current
rating is not exceeded.
3.
If critical signal lines (including the voltage and current sense
lines of the ADP3163) must cross through power circuitry,
it is best if a signal ground plane can be interposed between
those signal lines and the traces of the power circuitry. This
serves as a shield to minimize noise injection into the signals at
the expense of making signal ground a bit noisier.
4.
The power ground plane should not extend under signal
components, including the ADP3163 itself. If necessary,
follow the preceding guideline to use the signal ground
plane as a shield between the power ground plane and the
signal circuitry.
5.
The GND pin of the ADP3163 should be connected first to
the timing capacitor (on the CT pin), and then into the
signal ground plane. In cases where no signal ground plane
can be used, short interconnections to other signal ground
circuitry in the power converter should be used.
6.
The output capacitors of the power converter should be
connected to the signal ground plane even though power
current flows in the ground of these capacitors. For this
reason, it is advised to avoid critical ground connections
(e.g., the signal circuitry of the power converter) in the
signal ground plane between the input and output capaci-
tors. It is also advised to keep the planar interconnection
path short (i.e., have input and output capacitors close
together).
7.
The output capacitors should also be connected as closely
as possible to the load (or connector) that receives the power
(e.g., a microprocessor core). If the load is distributed, the
capacitors should also be distributed, and generally in pro-
portion to where the load tends to be more dynamic.
8.
Absolutely avoid crossing any signal lines over the switching
power path loop, described below.
Power Circuitry
9.
The switching power path should be routed on the PCB to
encompass the smallest possible area in order to minimize
radiated switching noise energy (i.e., EMI). Failure to take
proper precautions often results in EMI problems for the
entire PC system as well as noise-related operational prob-
lems in the power converter control circuitry. The switching
power path is the loop formed by the current path through
the input capacitors, the power MOSFETs, and the power
Schottky diode, if used (see next), including all intercon-
necting PCB traces and planes. The use of short and wide
interconnection traces is especially critical in this path for
two reasons: it minimizes the inductance in the switching
loop, which can cause high-energy ringing, and it accom-
modates the high current demand with minimal voltage loss.
10. MLC input capacitors should be placed between V
IN
and
power ground as close to the sources of the low-side
MOSFETS as possible.
11. To dampen ringing, an RC snubber circuit should be placed
from the SW hole of each phase to ground.
12. An optional power Schottky diode (3 A–5 A dc rating) from
each lower MOSFET’s source (anode) to drain (cathode)
will help to minimize switching power dissipation in the
upper MOSFETs. In the absence of an effective Schottky
diode, this dissipation occurs through the following sequence
of switching events. The lower MOSFET turns off in advance
of the upper MOSFET turning on (necessary to prevent
cross-conduction). The circulating current in the power
converter, no longer finding a path for current through the
channel of the lower MOSFET, draws current through the
inherent body diode of the MOSFET. The upper MOSFET
turns on, and the reverse recovery characteristic of the
lower MOSFET’s body diode prevents the drain voltage
from being pulled high quickly. The upper MOSFET then
conducts very large current while it momentarily has a high
voltage forced across it, which translates into added power
dissipation in the upper MOSFET. The Schottky diode
minimizes this problem by carrying a majority of the circu-
lating current when the lower MOSFET is turned off, and
by virtue of its essentially nonexistent reverse recovery time.
The Schottky diode has to be connected with very short
copper traces to the MOSFET to be effective.
13. Whenever a power dissipating component (e.g., a power
MOSFET) is soldered to a PCB, the liberal use of vias,
both directly on the mounting pad and immediately sur-
rounding it, is recommended. Two important reasons for
this are: improved current rating through the vias, and
improved thermal performance from vias extended to the
opposite side of the PCB where a plane can more readily
transfer the heat to the air.
相關PDF資料 |
PDF描述 |
|---|---|
| ADP3166 | 5-Bit Programmable 2-, 3-, 4-Phase Synchronous Buck Controller |
| ADP3166JRU-REEL | 5-Bit Programmable 2-, 3-, 4-Phase Synchronous Buck Controller |
| ADP3166JRU-REEL7 | 5-Bit Programmable 2-, 3-, 4-Phase Synchronous Buck Controller |
| ADP3170JRU | VRM 8.5 Compatible Single Phase Core Controller |
| ADP3170 | Charger front end protection IC with 30V max Vin and 4.5V LDO output 8-WSON 0 to 125 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ADP3163JRU | 制造商:AD 制造商全稱:Analog Devices 功能描述:5-Bit Programmable 2-/3-Phase Synchronous Buck Controller |
| ADP3163JRUZ-REEL | 功能描述:IC REG BUCK 5BIT 2-3PHAS 20TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 穩壓器 - 專用型 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,000 系列:- 應用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數:10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應商設備封裝:42-WLP 包裝:帶卷 (TR) |
| ADP3164 | 制造商:AD 制造商全稱:Analog Devices 功能描述:5-Bit Programmable 4-Phase Synchronous Buck Controller |
| ADP3164JRU | 制造商:AD 制造商全稱:Analog Devices 功能描述:5-Bit Programmable 4-Phase Synchronous Buck Controller |
| adp3164jruz-r7 | 制造商:ON Semiconductor 功能描述: |
發布緊急采購，3分鐘左右您將得到回復。