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參數資料
型號: ADP3419
廠商: Analog Devices, Inc.
英文描述: Dual Bootstrapped, High Voltage MOSFET Driver with Output Disable
中文描述: 雙自舉,高電壓MOSFET的輸出驅動器禁用
文件頁數: 11/16頁
文件大小: 317K
代理商: ADP3419
ADP3419
APPLICATION INFORMATION
SUPPLY CAPACITOR SELECTION
For the supply input (VCC) of the ADP3419, a local bypass
capacitor is recommended to reduce the noise and to supply
some of the peak currents drawn. Use a 10 μF or 4.7 μF
multilayer ceramic (MLC) capacitor. MLC capacitors provide
the best combination of low ESR and small size, and can be
obtained from the following vendors.
Table 5.
Vendor
Part Number
Murata
GRM235Y5V106Z16
Taiyo-Yuden
EMK325F106ZF
Tokin
C23Y5V1C106ZP
Rev. A | Page 11 of 16
Web Address
www.murata.com
www.t-yuden.com
www.tokin.com
Keep the ceramic capacitor as close as possible to the ADP3419.
BOOTSTRAP CIRCUIT
The bootstrap circuit uses a charge storage capacitor (C
BST
) and
a Schottky diode (D1), as shown in Figure 17. Selection of these
components can be done after the high-side MOSFET has been
chosen. The bootstrap capacitor must have a voltage rating that
is able to handle at least 5 V more than the maximum supply
voltage. The capacitance is determined by
BST
HSGATE
V
BST
Q
C
=
(1)
where:
Q
HSGATE
is the total gate charge of the high-side MOSFET.
V
BST
is the voltage droop allowed on the high-side MOSFET
drive.
For example, two IRF7811 MOSFETs in parallel have a total
gate charge of about 36 nC. For an allowed droop of 100 mV,
the required bootstrap capacitance is 360 nF. A good quality
ceramic capacitor should be used, and derating for the signifi-
cant capacitance drop of MLCs at high temperature must be
applied. In this example, selection of 470 nF or even 1 μF would
be recommended.
A Schottky diode is recommended for the bootstrap diode due
to its low forward drop, which maximizes the drive available for
the high-side MOSFET. The bootstrap diode must also be able
to handle at least 5 V more than the maximum battery voltage.
The average forward current can be estimated by
(2)
MAX
HSGATE
AVG
F
f
Q
I
×
=
)
(
where
f
MAX
is the maximum switching frequency of the
controller.
POWER AND THERMAL CONSIDERATIONS
The major power consumption of the ADP3419-based driver
circuit is from the dissipation of MOSFET gate charge. It can be
estimated as
MAX
LSGATE
HSGATE
MAX
P
f
Q
Q
(
VCC
×
+
×
)
(3)
where:
VCC
is the supply voltage 5 V.
f
MAX
is the highest switching frequency.
Q
HSGATE
and
Q
LSGATE
are the total gate charge of high-side and
low-side MOSFETs, respectively.
For example, the ADP3419 drives two IRF7821 high-side
MOSFETs and two IRF7832 low-side MOSFETs. According to
the MOSFET data sheets, Q
HSGATE
= 18.6 nC and Q
LSGATE
=
68 nC. Given that f
MAX
is 300 kHz, P
MAX
would be about
130 mW.
Part of this power consumption generates heat inside the
ADP3419. The temperature rise of the ADP3419 against its
environment is estimated as
η
×
×
θ
MAX
JA
P
T
(4)
where
θ
JA
is ADP3419’s thermal resistance from junction to air,
given in the absolute maximum ratings as 220°C/W for a
4-layer board.
The total MOSFET drive power dissipates in the output
resistance of ADP3419 and in the MOSFET gate resistance as
well.
η
represents the ratio of power dissipation inside the
ADP3419 over the total MOSFET gate driving power. For
normal applications, a rough estimation for
η
is 0.7. A more
accurate estimation can be calculated using
+
×
R
+
+
×
R
×
+
+
+
×
+
+
+
×
×
+
η
LSGATE
LSGATE
LSGATE
HSGATE
LSGATE
HSGATE
R4
HSGATE
R3
LSGATE
HSGATE
HSGATE
R4
R3
Q
Q
Q
R
R2
5
R2
R
R
R1
R1
Q
Q
Q
5
5
5
(5)
where:
R1
and
R2
are the output resistances of the high-side driver:
R1
= 1.7 (DRVH BST),
R2
= 0.8 (DRVH SW).
R3
and
R4
are the output resistances of the low-side driver:
R3
= 1.7 (DRVL VCC),
R4
= 0.8 (DRVL GND).
R
is the external resistor between the BST pin and the BST
capacitor.
R
HSGATE
and
R
LSGATE
are gate resistances of high-side and low-side
MOSFETs, respectively.
Assuming that
R
= 0 and that
R
HSGATE
=
R
LSGATE
= 0.5, Equation 5
gives a value of
η
= 0.71. Based on Equation 4, the estimated
temperature rise in this example is about 22°C.
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