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參數資料
| 型號： | ADUC831BS |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MicroConverter, 12-Bit ADCs and DACs with Embedded 62 kBytes Flash MCU |
| 中文描述： | 8-BIT, FLASH, 16.78 MHz, MICROCONTROLLER, PQFP52 |
| 封裝： | PLASTIC, MQFP-52 |
| 文件頁數： | 6/76頁 |
| 文件大小： | 1211K |
| 代理商： | ADUC831BS |
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REV. 0
–6–
ADuC831
SPECIFICATIONS
(continued)
NOTES
1
Temperature Range –40oC to +125oC.
2
ADC linearity is guaranteed during normal Micro Converter core operation.
3
ADC LSB Size = V
REF
/2
12
i.e., for Internal V
REF
= 2.5 V, 1 LSB = 610 V and for External V
REF
=1 V, 1 LSB = 244 V.
4
These numbers are not production tested but are guaranteed by design and/or characterization data on production release.
5
Offset and Gain Error and Offset and Gain Error Match are measured after factory calibration.
6
Based on external ADC system components, the user may need to execute a system calibration to remove additional external channel errors and achieve
these specifications.
7
SNR calculation includes distortion and noise components.
8
Channel-to-channel Crosstalk is measured on adjacent channels.
9
The Temperature Monitor will give a measure of the die temperature directly; air temperature can be inferred from this result.
10
DAC linearity is calculated using:
Reduced code range of 100 to 4095, 0 to V
REF
range.
Reduced code range of 100 to 3945, 0 to V
DD
range.
DAC Output Load = 10 k
and 100 pF.
11
DAC differential nonlinearity specified on 0 to V
REF
and 0 to V
DD
ranges
12
DAC specification for output impedance in the unbuffered case depends on DAC code.
13
DAC specifications for I
SINK
, voltage output settling time, and digital-to-analog glitch energy depend on external buffer implementation in unbuffered mode. DAC
in unbuffered mode tested with OP270 external buffer, which has a low input leakage current.
14
Measured with V
REF
and C
REF
pins decoupled with 0.1
μ
F capacitors to ground. Power-up time for the internal reference will be determined by the value of the
decoupling capacitor chosen for both the V
REF
and C
REF
pins.
15
When using an external reference device, the internal band gap reference input can be bypassed by setting the ADCCON1.6 bit. In this mode the V
REF
and C
REF
pins need to be shorted together for correct operation.
16
Flash/EE Memory reliability characteristics apply to both the Flash/EE program memory and the Flash/EE data memory.
17
Endurance is qualified to 100,000 cycles as per JEDEC Std. 22 method A117 and measured at -40oC, +25oC, and +125oC. Typical endurance at
25oC is 700,000 cycles.
18
Retention lifetime equivalent at junction temperature (Tj) = 55oC as per JEDEC Std. 22 method A117. Retention lifetime based on an activation energy of 0.6 eV
will derate with junction temperature as shown in Figure 18 in the Flash/EE Memory description section of this data sheet.
19
Power supply current consumption is measured in Normal, Idle, and Power-Down Modes under the following conditions:
Normal Mode:
Reset = 0.4 V, Digital I/O pins = open circuit, Core Executing internal software loop.
Idle Mode:
Reset = 0.4 V, Digital I/O pins = open circuit, Core Execution suspended in idle mode.
Power-Down Mode: Reset = 0.4 V, All Port 0 pins = 0.4 V, All other digital I/O pins and Port 1 are open circuit, OSC off, TIC off.
20
DV
DD
power supply current will increase typically by 3 mA (3 V operation) and 10 mA (5 V operation) during a Flash/EE memory program or erase cycle.
Specifications subject to change without notice.
Parameter
POWER REQUIREMENTS
19, 20
Power Supply Voltages
AV
DD
/DV
DD
to AGND
V
DD
= 5 V
V
DD
= 3 V
Unit
Test Conditions/Comments
2.7
3.3
V min
V max
V min
V max
AV
DD
/DV
DD
= 3 V nom
4.5
5.5
AV
DD
/DV
DD
= 5 V nom
Power Supply Currents Normal Mode
DV
DD
Current
AV
DD
Current
DV
DD
Current
6
1.7
25
21
1.7
3
1.7
12
10
1.7
mA typ
mA max
mA max
mA typ
mA max
MCLKIN = 1 MHz
MCLKIN = 1 MHz
MCLKIN = 16 MHz
MCLKIN = 16 MHz
MCLKIN = 16 MHz
AV
DD
Current
Power Supply Currents Idle Mode
DV
DD
Current
AV
DD
Current
DV
DD
Current
4
5
0.14
11
10
0.14
1
0.14
5
4
0.14
mA typ
mA typ
mA max
mA typ
mA typ
MCLKIN = 1 MHz
MCLKIN = 1 MHz
MCLKIN = 16 MHz
MCLKIN = 16 MHz
MCLKIN = 16 MHz
MCLKIN = 2 MHz or 16 MHz
AV
DD
Current
Power Supply Currents Power Down Mode
AV
DD
Current
DV
DD
Current
3
35
25
160
2.5
20
12
125
A typ
A max
A typ
A typ
TIMECON.1 = 0
TIMECON.1 = 1
AV
DD
= DV
DD
= 5 V
Typical Additional Power Supply Currents
PSM Peripheral
ADC
DAC
50
1.5
150
A typ
mA typ
A typ
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| ADUC831BS-REEL | 制造商:Analog Devices 功能描述:MCU 8-bit ADuC8xx 8052 CISC 62KB Flash 3.3V/5V 52-Pin MQFP T/R |
| ADUC831BSZ | 功能描述:IC ADC/DAC 12BIT W/MCU 52-MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 標準包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設備:POR，PWM，溫度傳感器，WDT 輸入/輸出數:21 程序存儲器容量:40KB（20K x 16） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數據轉換器:A/D 6x12b 振蕩器型:內部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
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| ADUC832 | 制造商:AD 制造商全稱:Analog Devices 功能描述:MicroConverter, 12-Bit ADCs and DACs with Embedded 62 kBytes Flash MCU |
| ADUC832BCP | 制造商:Analog Devices 功能描述:MCU 8-Bit ADuC8xx 8052 CISC 62KB Flash 3V/5V 56-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述:8BIT CISC 62KB FLASH 16.78MHZ 3.3/5V 56LFCSP - Bulk |
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