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參數資料
| 型號： | AM45DL3208GB70IS |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | 存儲器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA73 |
| 封裝： | 8 X 11.60 MM, FBGA-73 |
| 文件頁數： | 1/66頁 |
| 文件大小： | 1196K |
| 代理商： | AM45DL3208GB70IS |
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September 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-
inally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Am45DL3208G
Data Sheet
Publication Number
26460
Revision
B
Amendment
+1
Issue Date
March 12, 2004
相關PDF資料 |
PDF描述 |
|---|---|
| AM45DL3208GB70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| AM45DL3208GB70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GB85IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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